Sehen Sie, wie die Multiphysik-Simulation in verschiedenen Branchen eingesetzt wird
Multiphysik-Modellierung und -Simulation treiben Innovationen in Industrie und Wissenschaft voran – wie die zahlreichen Anwendungsbeispiele zeigen, die jedes Jahr in den Fachbeiträgen und Postern von Ingenieuren, Forschern und Wissenschaftlern auf der COMSOL Conference vorgestellt werden. Lassen Sie sich von den unten aufgeführten aktuellen Beiträgen inspirieren oder nutzen Sie die Schnellsuche, um eine bestimmte Präsentation zu finden oder nach Anwendungsbereich oder Konferenzjahr/-ort zu filtern.
Sehen Sie sich die Kollektion für die COMSOL Conference 2024 an
Baking is a central production step in the industrial production of edible wafers and waffles. The initially liquid batter is heated with a pair of metallic baking plates. Establishing a uniform and accurate temperature at the baking face (inner baking plate surface) is crucial for ... Mehr lesen
Microwave heating has been used in industry because of its pollution free and rapid heating technique [1]. It consists of an electromagnetic wave that passes through a media with a frequency between 300 MHz and 300 GHz [2] to generate heat in the system. The purpose of the current work ... Mehr lesen
Single turn coils produce AC and transient magnetic fields in pulsed magnetic technologies for which magneto-harmonic and transient magnetic analysis can be primarily performed. We suggest studying one single turn coil example made of a conducting massive coil, an optional conducting ... Mehr lesen
Materials such as aluminium with high thermal and electrical conductivities are of industrial interest, particularly for the automotive industry in the current context of increasing production of electric vehicles. The reflective properties of this material make it difficult to process ... Mehr lesen
Optimization of the shape of material for improving the power output of thermomagnetic oscillator Shivam Shukla a and Deepak K a,* a Department of Metallurgical Engineering, Indian Institute of Technology (BHU), Varanasi – 221005 *Corresponding author : deepak.met@iitbhu.ac.in Abstract ... Mehr lesen
The wide bandgap semiconductor silicon carbide (SiC) has drawn increasing attention in recent years as a promising material for high-power, high-frequency, and high-temperature operating devices. These outstanding properties of SiC make it a good candidate to replace silicon in many ... Mehr lesen
Simulation of laser processes are more and more efficient. In some cases, as welding and additive manufacturing, the physical phenomena are complex, multi-physics and multi-phases, thus some assumptions have to be done. For Laser Powder Bed Fusion, a laser beam melts and vaporizes the ... Mehr lesen
We present the model of THz sensor based on thermoelectric Bi-Sb thin films. The model is based on an electromagnetic heating interface and combines radiofrequency and heat transfer modules. The studied frequency was 0.14 THz, irradiation power 30 mW. Films had a thickness of 150 nm and ... Mehr lesen
Here we present a simulation for evaluation of novel obscurant candidates under high-energy laser (HEL) illumination. This approach incorporates thermal modeling into obscurant characterization, allowing for evaluation of the temperature increase of the candidate obscurants as well as ... Mehr lesen
A two dimensional instationary analysis of the conjugate optical-thermal fields induced in a multilayer thin film structure on a glass substrate by a moving Gaussian laser source is carried out numerically in order to compare back and front laser treatment processes. COMSOL Multiphysics ... Mehr lesen