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Multiphysik-Modellierung und -Simulation treiben Innovationen in Industrie und Wissenschaft voran – wie die zahlreichen Anwendungsbeispiele zeigen, die jedes Jahr in den Fachbeiträgen und Postern von Ingenieuren, Forschern und Wissenschaftlern auf der COMSOL Conference vorgestellt werden. Lassen Sie sich von den unten aufgeführten aktuellen Beiträgen inspirieren oder nutzen Sie die Schnellsuche, um eine bestimmte Präsentation zu finden oder nach Anwendungsbereich oder Konferenzjahr/-ort zu filtern.
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During usage, storage, and transportation, electronic products often become affected by a few unwanted adverse effects of the surrounding environment that compromise their working performance, reliability, and device life. There is evidence that environmental effects cause 52% of such ... Mehr lesen
Acoustic emissions generated by active defects in structures, like bridges, aircraft, and pipelines, play a crucial role in detecting flaws in their structural integrity by non-destructive evaluation techniques. Commercially used acoustic emission (AE) sensors are made of piezoelectric ... Mehr lesen
MEMS gyroscopes are typically challenging to model due to the variable length scales present in the device (typically 1000:1) and because the devices themselves are highly sensitive to both environmental and manufacturing-process-induced deviations from the ideal geometry. In this paper, ... Mehr lesen
Piezoelectric micromachined ultrasound transducers (PMUTs) are gaining increasing interest as miniaturized, low-power devices which can be easily integrated with electronic systems for applications such as medical imaging, therapeutic ultrasound, and particle manipulation. This work ... Mehr lesen
The monocrystalline semiconductor nanowires (NWs) attract great interest as they reveal new properties that differs from the ones of the bulk equivalents. In addition to small size (10-100 nm diameter), one of their advantages is extremely high surface to volume ratio. This determines ... Mehr lesen
Here we optimize the geometry: proof mass length Lm to total length L, thickness of the piezoelectric material (Tp) to total cantilever thickness (T) for obtaining the maximum stress distribution (Smax), output voltage (Vout) and power performance (Pout) of the unimorph Cantilever beam ... Mehr lesen
Heat management has became a bottleneck in electronic engineering because of the large amount of energy released by current devices due to its extreme level of miniaturization [1]. This is a very important limitation to achieve, for example, terahertz clock-rates in computing and it is ... Mehr lesen
This work presents a small swimmer model in a low Reynolds number ($Re$) environment governed by the equation of motion for Stokes flow in COMSOL Multiphysics®. The entity, a few centimetres helical robot, is located inside of a pipe full of silicone oil, where the forces caused by the ... Mehr lesen
