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Design and Simulation of MEMS-based Piezoelectric Accelerometer

Siram Sai Krishna[1], Nuti Venkata Subrahmanya Ayyappa Sai[1], Dr.K.Srinivasa Rao[2]
[1]Lakireddy Bali Reddy College of Engineering, Mylavaram, Andhra Pradesh, India
[2]Professor & HOD, Dept. of Electronics and Instrumentation Engineering, Lakireddy Bali Reddy College of Engineering, Mylavaram, Andhra Pradesh, India

The Micro electro mechanical systems (MEMS) technology provides us a platform to interface between mechanical and electrical components. In this paper, we have designed MEMS accelerometer based on piezoelectric property, and simulated using COMSOL Multiphysics®. The design, which has PZT kept in the annular diaphragm, provides good sensitivity. When this accelerometer is subjected to stress ...

Simple Finite Element Model of the Topografiner - new

H. Cabrera[1], D. A. Zanin[1], L. G. De Pietro[1], A. Vindigni[1], U. Ramsperger[1], D. Pescia[1]
[1]Laboratory for Solid State Physics, ETH Zürich, Zürich, Switzerland

In our recent experiments we are revisiting the topografiner technology for the imaging of surface topography with a resolution of a few nanometers. In these new technique called Near-Field Emission Scanning Electron Microscopy (NFESEM), low-energy electrons are emitted from a polycrystalline tungsten tip via electric-field assisted tunneling. In order to characterize and improve the ...

Optimization and Simulation of MEMS Based Thermal Sensor for Performance of Transformer Oil

V. Vijayalakshmi[1], K. C. Devi[1]
[1]PSG College of Technology, Coimbatore, Tamil Nadu, India

In this work, a bimetallic strip based thermal sensor was designed using MEMS module of COMSOL Multiphysics® software to monitor the temperature rise in insulating oil which was used as coolant in transformers. The bimetallic strip was designed with different shapes such as cylindrical, rectangle, square & conical and different compositions such as Al/Steel Alloy and Fe/Cu which can withstand ...

Analysis & Design Optimization of Laterally Driven PolySilicon Electro-thermal Microgripper for Micro-objects Manipulation

T. Pahwa[1], S. Gupta[1], V. Bansal[1], R. Narwal[1], B. Prasad[1], D. Kumar[1]
[1]Electronic Science Department, Kurukshetra University, Kurukshetra, India

Micro-grippers find applications in micro-robotics, microsurgery, micro-fluidics, micro-relays, assembling and miniature medical instrumentation. Actuation principle involved may be electrothermal, electrostatic, piezoelectric, shape memory and electromagnetic. It has been found that thermal actuation provides greater displacement at low voltages when compared to other mechanisms. A 3-D ...

Empirical Model Dedicated to the Sensitivity Study of Acoustic Hydrogen Gas Sensors Using COMSOL Multiphysics®

A. Ndieguene[1], I. Kerroum[1], F. Domingue[1], A. Reinhardt[2]
[1]Laboratoire des Microsystèmes et de Télécommunications/Université du Québec à Trois-Rivières, Trois-Rivières, QC, Canada
[2]Laboratoire d’Électronique et des Technologies de l’Information, CEA, LETI Grenoble, France

Due to the increasing demand for hydrogen gas sensors for applications such as automation, transportation, or environmental monitoring, the need for sensitive and reliable sensors with a short response time is increasing. This paper presents an empirical model that studies the sensitivity of acoustic hydrogen gas sensors. A parametric study based on the variation of physical properties of ...

Thermomechanical Effects of the Packaging Molding Process on the Chip in Integrated Circuits - new

N. Semmar[1], M. Fournier[1], P. S. Alleaume [2], A. Seigneurin [3], , ,
[1]GREMI-UMR7344, CNRS/University of Orléans, Orléans, France
[2]Collegium Sciences et Techniques, Orléans, France
[3]ST Microelectronics Tours SAS, Tours, France

Usually, in integrated circuits, the chip is brazed on leadframe and then, a polymer resin is molded around to create the packaging. On the first hand, the molding process at high temperatures will induce thermomechanical stress on the chip. As the leadframe, the chip and the braze have all different thermoelastic properties, these stress can be critical for the chip connections. To ...

Single Crystal Diamond NEMS Switch

M. Liao
Optical and Electronic Materials Unit
National Institute for Materials Science

A single-crystal diamond NEMS switch was fabricated while batch production of SCD MEMS/NEMS structures were developed. The diamond NEMS switches exhibit high performance with respect to high controllability, high reproducibility, and good reliability. Modeling and simulations were made that were consistent with experiments.

Modeling of Silicon Piezoresistive Pressure Sensor: Application to Prevent Some Diabetes Complications

F. Kerrour[1], A. Beddiaf[1], M. Benabbas-Marir[1]
[1]MODerNa Laboratory, University Mentouri, Constantine, Algeria

Several analytical solutions describing the mechanical behavior of a silicon micro membrane deflection, perfectly embedded and subjected to a uniform and constant pressure have been proposed. The obtained results are compared with those obtained by using COMSOL software for a rectangular diaphragm deflection. COMSOL Multiphysics is powerful software for solving problems based on partial ...

RFID-Enabled Temperature Sensor

I.M. Abdel-Motaleb[1], K. Allen [1]
[1]Department of Electrical Engineering, Northern Illinois University, DeKalb, IL, USA

The design of a RFID-enabled temperature sensor is described in this paper. In this sensor, a change in temperature causes structural beams to bend, which results in a proportional displacement of the plates of the capacitor. Plates\' displacement results, in turn, in changing the value of its capacitance. The capacitor of the sensor is coupled to the LC resonant network of a passive RFID tag. ...

Expanding Your Materials Horizons

R. Pryor[1]
[1]Pryor Knowledge Systems, Inc. (COMSOL Certified Consultant), Bloomfield Hills, Michigan, USA

Materials and their related properties are intrinsically fundamental to the creation, development and solution of viable exploratory models when using numerical analysis software. In many cases, simply determining the location, availability and relative accuracy of the necessary material parameters for the physical behavior of even commonly employed design materials can be very difficult and ...