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Sehen Sie, wie die Multiphysik-Simulation in Forschung und Entwicklung eingesetzt wird

Ingenieure, Forscher und Wissenschaftler aus allen Branchen nutzen die Multiphysik-Simulation, um innovative Produktdesigns und -prozesse zu erforschen und zu entwickeln. Lassen Sie sich von Fachbeiträgen und Vorträgen inspirieren, die sie auf der COMSOL Conference präsentiert haben. Durchsuchen Sie die untenstehende Auswahl, verwenden Sie die Schnellsuche, um eine bestimmte Präsentation zu finden, oder filtern Sie nach einem bestimmten Anwendungsbereich.

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Bengaluru 2023

Munich 2023

MEMS and Nanotechnologyx

A Consistent Environment for the Numerical Prediction of the Properties of Composite Materials

J. Schumacher[1], P. Fideu[2], G. Ziegmann[1], and A. Herrmann[3]
[1]TU Clausthal-Institute of Polymere Materials and Plastic Engineering, Clausthal-Zellerfeld, Germany
[2]CTC GmbH Stade, Stade, Germany
[3]Faserinstitut Bremen e.V., Bremen, Germany

The current paper focuses on the creation of a consistent environment for the numerical prediction of the physical properties of polymer composite. A limitation factor for the successful simulation of composite processes is the correct estimation of the effective properties depending on ... Mehr lesen

A Study of Curved Flexures for MEMS

Minhee Jun[1], and Jason V. Clark[1]
[1]Departments of Electrical and Computer Engineering, Purdue University, West Lafayette, IN, USA

Large deflection actuators are becoming increasingly important for microsystems. Since actuation forces are usually small, large deflection actuators usually require flexures with low stiffness. Rectangular serpentine flexures are often used for such actuators due to their low stiffness ... Mehr lesen

High Coupling Factor Piezoelectric Materials for Bending Actuators: Analytical and Finite Elements Modeling Results

I.A. Ivan[1], M. Rakotondrabe[1], and N. Chaillet[1]
[1]FEMTO-ST Institute, University of Franche-Comte, Besançon, France

New giant piezoelectric factor materials such as PMN-PT and PZN-PT were researched during the last decade and are actually becoming commercially available. As they seem very attractive for actuator designs, we studied their potential in replacing PZT ceramics. In a first comparative ... Mehr lesen

Mobility of Catalytic Self-Propelled Nanorods Modeling with COMSOL Multiphysics^®

F. Lugli[1] and F. Zerbetto[1]
[1]Department of Chemistry “G. Ciamician”, Università di Bologna, Bologna, Italy

A small particle or a nano-sized object placed in a liquid is subject to random collisions with solvent molecules. The resulting erratic movement of the object is known as Brownian motion, which, in nature, cannot be used to any practical advantage both in natural systems (such as ... Mehr lesen

Phasefield Modeling of Ferroelectric Materials

Marc Kamlah
Head of the Mechanics of Materials Department, Forschungszentrum Karlsruhe, Germany

Outline of presentation: theory of phase-field modeling of ferroelectric materials parameter identification in free energy density finite element implementation: PDE form weak form periodic boundary conditions: electrical mechanical domain configurations intrinsic and extrinsic ... Mehr lesen

Oxidation of Metallic Nanoparticles

A. Auge[1], A. Weddemann[1], F. Wittbracht[1], B. Vogel[1], and A. Hütten[1]

[1]Department of Physics, Thin Films and Physics of Nanostructures, Bielefeld University, Bielefeld, Germany

The oxidation behavior of metallic nanoparticles is investigated in respect to material parameters like Mott potential, defects on the microstructure and oxide volume increase per ionic defect. An emphasis is laid on magnetic nanoparticles where the degree of oxidation can be measured ... Mehr lesen

Simulation of Daisy Chain Flip-Chip Interconnections

G.S. Durante[1] and M. Fretz[1]

[1]CSEM Zentralschweiz, Alpnach Dorf, Switzerland

Flip-chip interconnection technologies have been tested through the use of a test chip with embedded single-bump daisy chains. The Flip-Chip technologies are selected among Au bump Thermocompression (TC) with and without Nonconductive Adhesives (NCA) underfiller, anisotropic conductive ... Mehr lesen

Modelling of Micro/Macro Densification Phenomena of Cu Powder during Capacitor Discharge Sintering

G. Maizza[1] and A. Tassinari[1]

[1]Dipartimento di Scienza dei Materiali ed Ingegneria Chimica, Politecnico di Torino, Torino, Italy

Capacitor Discharge Sintering (CDS) is an ultrafast Electric Current Assisted Sintering method (u-ECAS) suited for electrically conductive powders. It is characterized by relatively short processing times (milliseconds range) and much lower sintering temperatures than the melting point ... Mehr lesen

Modelling of SiC Chemical Vapour Infiltration Process Assisted by Microwave Heating

G. Maizza[1] and M. Longhin[1]
[1]Dipartimento di Scienza dei Materiali ed Ingegneria Chimica, Politecnico di Torino, Torino, Italy

The excessive presence of residual SiC matrix inter-fiber pores is often the main cause for the very poor mechanical strength and toughness of SiC/SiC composites manufactured by CVI (Chemical Vapour Infiltration) process. This work presents a micro/macro Microwaveassisted Chemical Vapour ... Mehr lesen

Dynamic Observation of Magnetic Particles in Continuous Flow Devices by Tunneling Magnetoresistance Sensors

A. Weddemann[1], A. Auge[1], F. Wittbracht[1], C. Albon[1], and A. Hütten[1]

[1]Department of Physics, Thin Films and Physics of Nanostructures, Bielefeld University, Bielefeld, Germany

Dynamic measurement of magnetic particles in continuous flow devices is made very difficult by the limitations imposed by the sensors themselves. Thus, certain sensor layouts are restricted to either number sensitive or spatial resolutive measurements of magnetic particles. We ... Mehr lesen

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