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Sehen Sie, wie die Multiphysik-Simulation in Forschung und Entwicklung eingesetzt wird

Ingenieure, Forscher und Wissenschaftler aus allen Branchen nutzen die Multiphysik-Simulation, um innovative Produktdesigns und -prozesse zu erforschen und zu entwickeln. Lassen Sie sich von Fachbeiträgen und Vorträgen inspirieren, die sie auf der COMSOL Conference präsentiert haben. Durchsuchen Sie die untenstehende Auswahl, verwenden Sie die Schnellsuche, um eine bestimmte Präsentation zu finden, oder filtern Sie nach einem bestimmten Anwendungsbereich.

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Suchbegriff:

Inverse Analysis of Soil Parameters Based on Deformation of a Bank Protection Structure

Y. Xing [1], R. Hu [2], Q. Liu [1],
[1] Geoscience Centre, University of Goettingen, Goettingen, Germany
[2] School of Earth Science and Engineering, Hohai University, Nanjing, China

Deformation prediction is an important part of the structure stability analysis. However, the deformation of bank protection structure which is affected by many factors, such as structural stiffness, earth pressure and hydrostatic pressure. It contains a complex mechanical process, which ... Mehr lesen

Multiphysics Simulation of Micro-Thermoelectric Generators Based on Power Factor Optimized Materials

V. Barati [1], H. Reith [1], G. Li [1], D. A. Lara Ramos [1], G. Schierning [1], K. Nielsch [1],
[1] Leibniz Institute for Solid State and Material Research, Dresden, Germany

Thermoelectric generators (TEGs) which convert heat into electrical energy due to Seebeck effect, have recently attracted a great attention as green and sustainable energy sources. One of the challenges in the field of thermoelectric devices is the design optimization in order to make ... Mehr lesen

Polynomial-Chaos Uncertainty Modeling in Eddy-Current Inspection of Cracks

T. T. Zygiridis [1], A. E. Kyrgiazoglou [2], T. P. Theodoulidis [2],
[1] Department of Informatics and Telecommunications Engineering, University of Western Macedonia, Kozani, Greece
[2] Department of Mechanical Engineering, University of Western Macedonia, Kozani, Greece

In the context of non-destructive evaluation methods, eddy-current testing plays a prominent role in crack-detection problems, due to its various attractive features. One of the physical quantities that typically interest us in such type of problems is the – complex – coil impedance and ... Mehr lesen

Computational Study on Transcutaneous Frontal Nerve Stimulation: Simplification of Human Head Model

E. Salkim [1], A. N. Shiraz [1], A. Demosthenous [1],
[1] Electronic and Electrical Department, University College London, London, UK

I. INTRODUCTION Migraine is a neurological disorder which affects nearly 15% of the population and it has been estimated that the European Community spends about €27 billion in a year. Its symptoms may be categorized as attacks of often severe, throbbing head pain with sensory ... Mehr lesen

Numerical Simulation of PCB-Coil-Layouts for Inductive Energy Transfer Systems

D. Maier [1], N. Lucht [1], A. Enssle [1], A. Lusiewicz [1], J. Fischer [1], U. Pecha[1], N. Parspour [1]
[1] Stuttgart University, Institute of Electrical Energy Conversion, Stuttgart, Germany

This paper presents the two dimensional (2D) Finite Element Method (FEM) COMSOL Multiphysics® model of a PCB-Coil layout. The model comprises of different coil layouts for sake of comparison. The scientific goal of the simulation is to find an optimized arrangement with a high quality ... Mehr lesen

Numerical Calculation of the Three Dimensional Inter-Bar Current Distribution in Induction Machines

J. Güdelhöfer [1], R. Gottkehaskamp [1], A. Möckel [2],
[1] University of Applied Sciences Düsseldorf, Düsseldorf, Germany
[2] Technical University of Ilmenau, Ilmenau, Germany

The calculation of additional losses in induction machines is a challenging task. In skewed motors, a part of these losses is connected to the phenomena of inter-bar currents. Inter-bar currents flow between adjacent bars through the rotor lamination. Since they are aligned perpendicular ... Mehr lesen

Multiphysical Simulation of Moved Data Cable

M. Raum [1]
[1] Friedrich-Alexander Universität, Erlangen, BY, Germany

In general this thesis is about the effects of mechanical stress on data cables in moved applications. If a data cable is loaded with different kind of forces and used within high frequency applications it is possible, that the geometrical changes may have an impact on the electrical ... Mehr lesen

CMOS Based Atom Chips for Sensor Applications

Ph. Neuman [1], A. Nemecek [1], C. Koller [2]
[1] Department for Micro-and Nanosystems, University of Applied Sciences Wiener Neustadt, Austria
[2] Department for Micro-and Nanosystems, University of Applied Sciences Wiener Neustadt, Austria, and School of Physics and Astronomy, University of Nottingham, Nottingham, UK

Ultra-cold atomic systems have proven over the last decade to be a excellent platform for the realization of quantum sensors, quantum computation or quantum simulation applications. A special implementation of this technology is the so called atom chip, where the magnetic fields ... Mehr lesen

Design and Optimization of Power Cable Accessories Using COMSOL Multiphysics®

A. Lewarkar [1], D. Bergsma [1], S. Madhar [2],
[1] E&D Department, Lovink Enertech B.V., Terborg, Netherlands
[2] Electrical Engineering Department, Delft University of Technology, Delft, Netherlands

Power cable manufacturing is limited by the maximum length of cable that can be produced and stored on cable drums. This creates a need or rather an opportunity for a cable accessory, namely 'Cable Joints'. Joints are an impeccable component in the power cable network that necessitate ... Mehr lesen

Green's Function Approach to Efficient 3D Electrostatics of Multi-Scale Problems

C. Roman [1], L. Schmid [1], L. Stolpmann [1], C. Hierold [1],
[1] ETH, Zurich, Switzerland

We present an efficient method to compute efficiently the general solution (Green's Function) of the Poisson Equation in 3D. The method proves its effectiveness when dealing with multi-scale problems in which lower dimensional objects, such as nanotubes or nanowires (1D), are embedded in ... Mehr lesen

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