Sehen Sie, wie die Multiphysik-Simulation weltweit in der Forschung eingesetzt wird
Multiphysik-Modellierung und -Simulation treiben Innovationen in Industrie und Wissenschaft voran – wie die zahlreichen Anwendungsbeispiele zeigen, die jedes Jahr in den Fachbeiträgen und Postern von Ingenieuren, Forschern und Wissenschaftlern auf der COMSOL Conference vorgestellt werden. Lassen Sie sich von den unten aufgeführten aktuellen Beiträgen inspirieren oder nutzen Sie die Schnellsuche, um eine bestimmte Präsentation zu finden oder nach Anwendungsbereich oder Konferenzjahr/-ort zu filtern.
Sehen Sie sich die Sammlung für die COMSOL Conference 2026 an
The focus of this work is to determine the potential for arrays of nanoscale bowtie antennas for light enhancement and direction control in nano-optics devices. This is achieved by studying the effects of illumination on the backscattered and total fields, along with the intensity of the ... Mehr lesen
The presence of anthropogenic or natural pollutants in groundwater system poses a threat to water resources. Several remediation techniques have been explored and developed to decrease the concentration of contaminants. One such remediation technique, injection of nano-particles in the ... Mehr lesen
Interacting with digital devices has become part of daily life, whether in consumer products, services, or industrial applications. Most display-based devices provide user interactivity through touch sensing via a touch panel. As the number of device features increases, it demands an ... Mehr lesen
Plastic packages, coated with Epoxy Molding Compound (EMC) can provide an economic and versatile protection to the integrated circuits (IC) from mechanical damage. A major drawback of molded packages is that they are not hermetic and are prone to absorb moisture from external ... Mehr lesen
According to a World Health Organization report, more than 360 million people suffer from hearing loss [1]. The majority of patients can usually be fitted with conventional hearing aids. These devices are subject to continuous further development and optimization - connecting the ... Mehr lesen
During semiconductor manufacturing, finished silicon microchips need to be released from a carrier tape they stick to by an adhesive. This is done by vacuum forces that (a) hold the chip flat from above and (b) pull the tape off from the chip underside. Sounds simple, but is very tricky ... Mehr lesen
The EPFLoop team from Ecole Polytechnique Fédérale de Lausanne has developed a capsule thanks to which it achieved 3rd place in SpaceX’s Hyperloop Pod Competition in 2018. This year the EPFLoop team has been selected again to participate at the 2019 Competition held at the SpaceX ... Mehr lesen
The EPFLoop team from Lausanne last year won the 3rd place in SpaceX’s Hyperloop Pod Competition in 2018. This year the team will participate at the 2019 Competition held at the SpaceX facilities California. Reliability of the different subsystems constituting the pod is a key point. ... Mehr lesen
