Sehen Sie, wie die Multiphysik-Simulation in Forschung und Entwicklung eingesetzt wird
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Sehen Sie sich die Kollektion für die COMSOL Conference 2024 an
Micro-scale devices based on the Stirling cycle are an attractive choice for chip- and board-level electronics. A new Stirling cycle micro-refrigeration system composed of arrays of silicon MEMS cooling elements has been designed. COMSOL is used to evaluate the thermal performance of ... Mehr lesen
The MEMS microphone is also called microphone chip or silicon microphone. The pressure sensitive diaphragm is etched directly into a silicon chip by MEMS techniques and is usually accompanied with integrated preamplifier. Most MEMS microphones are variants of the condenser microphone ... Mehr lesen
This paper presents a novel design of single-bit RF MEMS phase shifter. The basic novelty introduced for phase shifter design in this case, is by scaling down of the lateral dimensions of the conventional RF MEMS shunt switch by 10 times. The Mechanical and Electromechanical analysis ... Mehr lesen
In this paper an Electromagnetic Solenoid Actuator (EMVA) consisting of an upper and lower electromagnet, a linear moving armature and two preloaded springs is considered as a potential approach in Variable Valve Actuation (VVA) systems for internal combustion engines. The analysis of ... Mehr lesen
Seals or gaskets that are compressed between walls of a container are important to many industrial applications. In this paper we present a fluid flow model for predicting the sealing performance of such seals. A computational study using COMSOL Multiphysics® software suggests very ... Mehr lesen
The simulation of the piezoelectric actuation of the micro-cantilever is presented. Lead Zirconate Titanate (PZT) was chosen for the device fabrication design, due to its thin film processing flexibility. Four layers compose the cantilever structures presented in this work: PZT ... Mehr lesen
In this paper 3D electro-thermal FE Model using COMSOL Multiphysics® software of power vertical MOSFET used in the automotive industry is presented. This model is used to analyze the effects of bonding wire lift off defect and to study the influence of metallization thickness and ... Mehr lesen
Development of very high speed integrated circuits is currently of great interest for today\'s technologies. This paper presents the quasi-TEM approach for the accurate parameters extraction of multiconductor transmission lines interconnect in single, two, and three-layered dielectric ... Mehr lesen
This paper presents an analysis approach of multicondcutor quasi-TEM lines transmission interconnect in a single dielectric region and multimode waveguides using the finite element method (FEM). FEM is especially suitable and effective for the computation of electromagnetic fields in ... Mehr lesen
The main objective of this study is to verify the compliance of an ongoing nuclear facilities stack design with the ISO 2889 requirements, during normal and off-normal conditions. In particular, with the numerical simulations, they have been identify well-mixed sample locations along the ... Mehr lesen