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Sehen Sie, wie die Multiphysik-Simulation in Forschung und Entwicklung eingesetzt wird

Ingenieure, Forscher und Wissenschaftler aus allen Branchen nutzen die Multiphysik-Simulation, um innovative Produktdesigns und -prozesse zu erforschen und zu entwickeln. Lassen Sie sich von Fachbeiträgen und Vorträgen inspirieren, die sie auf der COMSOL Conference präsentiert haben. Durchsuchen Sie die untenstehende Auswahl, verwenden Sie die Schnellsuche, um eine bestimmte Präsentation zu finden, oder filtern Sie nach einem bestimmten Anwendungsbereich.

Sehen Sie sich die Kollektion für die COMSOL Conference 2023 an

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Bengaluru 2023

Munich 2023

Inverse Analysis for Heat Transfer Coefficient Identification

F. Tondini[1], P. Bosetti[1], and S. Bruschi[1]

[1]DIMS, University of Trento, Trento, Italy

The hot stamping of boron steels for producing complex structural components of the car body-in-white is more and more widespread. Optimization of sheet forming technologies at elevated temperatures is still troublesome, since the thermal, mechanical and metallurgical phenomena ... Mehr lesen

Oxidation of Metallic Nanoparticles

A. Auge[1], A. Weddemann[1], F. Wittbracht[1], B. Vogel[1], and A. Hütten[1]

[1]Department of Physics, Thin Films and Physics of Nanostructures, Bielefeld University, Bielefeld, Germany

The oxidation behavior of metallic nanoparticles is investigated in respect to material parameters like Mott potential, defects on the microstructure and oxide volume increase per ionic defect. An emphasis is laid on magnetic nanoparticles where the degree of oxidation can be measured ... Mehr lesen

Simulation of Daisy Chain Flip-Chip Interconnections

G.S. Durante[1] and M. Fretz[1]

[1]CSEM Zentralschweiz, Alpnach Dorf, Switzerland

Flip-chip interconnection technologies have been tested through the use of a test chip with embedded single-bump daisy chains. The Flip-Chip technologies are selected among Au bump Thermocompression (TC) with and without Nonconductive Adhesives (NCA) underfiller, anisotropic conductive ... Mehr lesen

Simulation of a Heated Tool System for Jet Electrochemical Machining

M. Hackert[1], G. Meichsner[2], and A. Schubert[1][2]

[1]Chair Micromanufacturing Technology, Faculty of Mechanical Engineering, Chemnitz University of Technology, Chemnitz, Germany
[2]Fraunhofer Institute for Machine Tools and Forming Technology, Chemnitz, Germany

Jet Electrochemical Machining (Jet-ECM) is an unconventional procedure using localized anodic dissolution for micromachining. An increasing of the electrolyte temperature will lead to an increase of the electrical conductivity of the electrolyte by about 30% and to a reduction of the ... Mehr lesen

Modelling of Micro/Macro Densification Phenomena of Cu Powder during Capacitor Discharge Sintering

G. Maizza[1] and A. Tassinari[1]

[1]Dipartimento di Scienza dei Materiali ed Ingegneria Chimica, Politecnico di Torino, Torino, Italy

Capacitor Discharge Sintering (CDS) is an ultrafast Electric Current Assisted Sintering method (u-ECAS) suited for electrically conductive powders. It is characterized by relatively short processing times (milliseconds range) and much lower sintering temperatures than the melting point ... Mehr lesen

Modelling of SiC Chemical Vapour Infiltration Process Assisted by Microwave Heating

G. Maizza[1] and M. Longhin[1]
[1]Dipartimento di Scienza dei Materiali ed Ingegneria Chimica, Politecnico di Torino, Torino, Italy

The excessive presence of residual SiC matrix inter-fiber pores is often the main cause for the very poor mechanical strength and toughness of SiC/SiC composites manufactured by CVI (Chemical Vapour Infiltration) process. This work presents a micro/macro Microwaveassisted Chemical Vapour ... Mehr lesen

Dynamic Observation of Magnetic Particles in Continuous Flow Devices by Tunneling Magnetoresistance Sensors

A. Weddemann[1], A. Auge[1], F. Wittbracht[1], C. Albon[1], and A. Hütten[1]

[1]Department of Physics, Thin Films and Physics of Nanostructures, Bielefeld University, Bielefeld, Germany

Dynamic measurement of magnetic particles in continuous flow devices is made very difficult by the limitations imposed by the sensors themselves. Thus, certain sensor layouts are restricted to either number sensitive or spatial resolutive measurements of magnetic particles. We ... Mehr lesen

Numerical Simulation of Pulsed TIG Welding Partial and Full Penetration

A. Traidia[1][2], F. Roger[1], and E. Guyot[2]

[1]Ecole Nationale Supérieure de Techniques Avancées, Palaiseau, France
[2]AREVA NP, Centre Technique Soudage, France

In this poster, a numerical model of spot pulsed current TIG welding for partially and fully penetrated weld pools is presented. Heat transfer and fluid flow in the weld pool driven by the combination of electromagnetic force, buoyancy force, surface tension gradient and latent heat are ... Mehr lesen

A Study of Optical Sensor Based on Fiber Bragg Grating Using COMSOL Multiphysics^®

C. Gavrila[1] and I. Lancranjan[2]

[1]Technical University of Civil Engineering Bucharest, Bucharest, Romania
[2]Advanced Study Centre, National Institute for Aerospace Research “Elie Carafoli”, Bucharest, Romania

Fiber optic sensors can measure a large range of physical, chemical and environmental variables such as temperature, pressure, shape, position, chemical concentration, moisture, etc. Fiber optic sensors provide measurements in applications where the conventional electrical based sensors ... Mehr lesen

Streamer Propagation in a Point-to-Plane Geometry

M. Quast[1] and N.R. Lalic[1]
[1]Gunytronic GmbH, St Valentin, Germany

Corona discharge is used in several applications such as surface treatment of polymers, photocopying or dust removal in air conditioning. Streamer formation is undesirable for most of these applications. Therefore, several studies have been dedicated to investigate the formation and ... Mehr lesen

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