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Multiphysik-Modellierung und -Simulation treiben Innovationen in Industrie und Wissenschaft voran – wie die zahlreichen Anwendungsbeispiele zeigen, die jedes Jahr in den Fachbeiträgen und Postern von Ingenieuren, Forschern und Wissenschaftlern auf der COMSOL Conference vorgestellt werden. Lassen Sie sich von den unten aufgeführten aktuellen Beiträgen inspirieren oder nutzen Sie die Schnellsuche, um eine bestimmte Präsentation zu finden oder nach Anwendungsbereich oder Konferenzjahr/-ort zu filtern.

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Failure Modes of Underground MV Cables: Electrical and Thermal Modelling

P.A. Wallace[1], M. Alsharif[1], D.M. Hepburn[1], and C. Zhou[1]
[1]Department of Energy Systems Engineering, Glasgow Caledonian University, Glasgow, United Kingdom

Two simulations of the performance of a Paper Insulated Lead Covered (PILC) Medium Voltage (MV) underground cable are presented. The first presents the thermal response of a cable, over seven days, to a realistic load with a diurnal variation. The second concentrates on the variation of ... Mehr lesen

Modelling Waste Water Flow in Hollow Fibre Filters

I. Borsi[1] and A. Fasano[1]
[1]Dipartimento di Matematica U. Dini, Università di Firenze, Firenze, Italy

In this paper we present a model to describe the process of waste water filtration based on hollow-fibre membrane filters. In particular, we deal with membranes whose pores diameter is in the range 0.01-0.1 µm. The main problem in these filtering systems is the membrane fouling. ... Mehr lesen

Transport Phenomena and Shrinkage Modeling During Convective Drying of Vegetables

S. Curcio[1] and M. Aversa[1]
[1]Department of Engineering Modeling, University of Calabria, Arcavacata di Rende, CS, Italy

The aim of the present work is the formulation of a theoretical model describing the transport phenomena involved in food drying process. The attention has been focused on the simultaneous transfer of momentum, heat and mass occurring in a convective drier where hot dry air flows, in ... Mehr lesen

Local Conduction Heat Transfer in U-pipe Borehole Heat Exchangers

J. Acuna[1] and B. Palm[1]

[1]Department of Energy Technology, KTH, Stockholm, Sweden

The most common way to exchange heat with the bedrock in Ground Source Heat Pump (GSHP) applications is circulating a fluid through a U-formed closed loop in vertical boreholes drilled several tenths of meters into the ground. This study presents and compares the results of eight cross ... Mehr lesen

Detection of Magnetic Particles by Magnetoresistive Sensors

A. Weddemann[1], A. Auge[1], F. Wittbracht[1], C. Albon[1], and A. Hütten[1]
[1]Department of Physics, Thin Films and Physics of Nanostructures, Bielefeld University, Bielefeld, Germany

In this work, we demonstrate the implementation of the micromagnetic equations for the description of ferromagnetic thin films in COMSOL Multiphysics®. We apply our model to magnetoresistive sensors consisting of several soft ferromagnetic layers and their response to magnetic particles. ... Mehr lesen

Model of Heat and Mass Transfer with Moving Boundary During Roasting of Meat in Convection-Oven

A.H. Feyissa[1], J. Adler-Nissen[1], and K.V. Gernaey[2]
[1]Food Production Engineering, National Food Institute, Technical University of Denmark, Kgs. Lyngby, Denmark
[2]Department of Chemical and Biochemical Engineering, Technical University of Denmark, Kgs. Lyngby, Denmark

A 2D mathematical model of coupled heat and mass transfer describing oven roasting of meat was formulated from first principles. The current formulation of model equations incorporates the effect of shrinkage phenomena and water holding capacity. The model equations are based on ... Mehr lesen

3D Electro-Thermal Study for Reliability of Automotive Power Vertical MOSFET Using COMSOL Multiphysics^®

T. Azoui[1], S. Verde[1][2], J.B. Sauveplane[1], and P. Tounsi[1]
[1]LAAS-CNRS, Toulouse, France
[2]Department of Electronics and Telecommunications Engineering, University of Naples Federico II, Naples, Italy

In this paper 3D electro-thermal FE Model using COMSOL Multiphysics® software of power vertical MOSFET used in the automotive industry is presented. This model is used to analyze the effects of bonding wire lift off defect and to study the influence of metallization thickness and ... Mehr lesen

Thermal Simulation and Package Investigation of Wireless Gas Sensors

A. Paoli[1], L. Seminara[2], D.D. Caviglia[1], A. Garibbo[2], and M. Valle[1]

[1]Department of Biophysical and Electronic Engineering, University of Genova, Genova, Italy
[2]SELEX Communications S.p.A., Genova, Italy

Gas sensor arrays based on metal oxides operating at high temperature are commonly used in many application fields. They can operate on different principles and each sensor may show very different responses to the individual gases in the environment. Data coming from the array can be ... Mehr lesen

Chip Drop After Silver Sintering Process

M.H. Poech[1], M. Weiß[1], and K. Gruber[1]

[1]Fraunhofer Institute for Silicon Technology, Itzehoe, Germany

Since a couple of years, sintering becomes more and more important for power electronics. To press a semiconductor under high temperature in silver paste on a substrate promises benefits for durability. Tests with semiconductors of different thickness expose some problems. After the cool ... Mehr lesen

Multi-Scale Modelling of Catalytic Microreactors

B. Hari[1] and C. Theodoropoulos[1]
[1]The University of Manchester, School of Chemical Engineering and Analytical Science, Manchester, UK

Microreactors are important alternative to conventional reactors in chemistry, chemical, pharmaceutical and semiconductor industries due to their operation characteristics such as increased mass and heat transfer, uniform flow, safety, high throughput through array configurations, ... Mehr lesen

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