Sehen Sie, wie die Multiphysik-Simulation in verschiedenen Branchen eingesetzt wird
Multiphysik-Modellierung und -Simulation treiben Innovationen in Industrie und Wissenschaft voran – wie die zahlreichen Anwendungsbeispiele zeigen, die jedes Jahr in den Fachbeiträgen und Postern von Ingenieuren, Forschern und Wissenschaftlern auf der COMSOL Conference vorgestellt werden. Lassen Sie sich von den unten aufgeführten aktuellen Beiträgen inspirieren oder nutzen Sie die Schnellsuche, um eine bestimmte Präsentation zu finden oder nach Anwendungsbereich oder Konferenzjahr/-ort zu filtern.
Sehen Sie sich die Kollektion für die COMSOL Conference 2024 an
A 3D thermo-mechanical simulation was developed using COMSOL Multiphysics software in order to predict distortion of a welded dissimilar titanium alloys structure. An angular distortion and a longitudinal shrinkage are predicted in agreement with those obtained experimentally. Mehr lesen
Electroacoustic resonators employing surface acoustic waves (SAW) are commercially widely used in RF filters, low noise frequency sources as well as various sensors. In all of these applications the resonance quality factor appears to be a limiting performance factor. Quite often ... Mehr lesen
A 1D-axisymmetric model was built to represent the drying of a single d’Ente plum to d’Agen prune. Underlying assumptions of the model were those of Di Matteo et al. 2003. Sorption isotherms of plum come from Tsami et al, 1990 and equation structure of apparent water diffusion ... Mehr lesen
The aim of the simulation is to study the behavior of a particular arrangement of a sealing system made of a Toroidal Spring Coil encapsulated in an thin casing, which is provided with a circumpherential cut to permit the pressure fill it inside. The mechanical simulation implemented ... Mehr lesen
Electromigration induced failure is one of the main reliability issues for the microelectronics industry. The continuous scaling of the interconnect dimensions leads to higher operating current densities and temperatures, which accentuates the electromigration failure. As a consequence, ... Mehr lesen
Adaptive Optics is common sense, since many people use digital cameras with electromechanical iris actors on elastic autofocus lenses. This project tries to create a COMSOL Multiphysics based mathematical model of adaptive optics with electrostatically induced deformation of dielectric ... Mehr lesen
Silicon wafers represent key elements in modern microelectronics or photovoltaics. Technological fabrications of wafer sizes with large diameters (e.g. 450 mm) allow an efficient realization for integrated circuits at low cost. However, this material shows a high sensitivity to ... Mehr lesen
The "Lithic Hypar" research is based on the mechanical analysis of an innovative reinforced stone's structure, architecturally designed by Prof. Fallacara, University of Bari (Italy): the headquarters entrance portal of the French company SNBR (Société Nouvelle Batiment Régional) located ... Mehr lesen
Electronic devices produce a very high rate of specific heat with respect to their dimensions. Exceeding in maximum safe operating temperature means strong reduction of efficiency, reliability and lifetime. In addition, electronic devices are subjected to periodical thermal loading. ... Mehr lesen
The design of ESS-Bilbao RFQ (RadioFrequency Quadrupole) linear accelerator cavity using COMSOL Multiphysics is presented. The work includes geometry definition, electrostatics, electromagnetic and thermomechanical coupled simulations. The main part of the work corresponds to the ... Mehr lesen