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0 Replies 1372 Views
Version 3.5a
Edouard Nesvijski posted 1 decade ago
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0 Replies 1788 Views
Version 4.1
Pengxin Zhang posted 1 decade ago
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1 Replies 3488 Views
Version 4.0a Acoustics & VibrationsStructural Mechanics
User COMSOL posted 1 decade ago reply 1 decade ago by Ivar KJELBERG
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0 Replies 2400 Views
Version 4.1 Low-Frequency Electromagnetics
Tonis Hobejogi posted 1 decade ago
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How can i model semiconductor and its packaging in Comsol using CAD and test under electrical, mechnical and thermal aspect.
read0 Replies 1159 ViewsRashedul Karim posted 1 decade ago
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0 Replies 784 Views
Rose posted 1 decade ago
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0 Replies 1761 Views
Version 4.1 Structural Mechanics
Yong LI posted 1 decade ago
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7 Replies 5586 Views
Anna Cyganowski posted 2 decades ago reply 1 decade ago by Usman Khan
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1 Replies 4185 Views
Version 4.0a
Ying Peng posted 1 decade ago reply 1 decade ago by Edgar Kaiser
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1 Replies 1963 Views
Version 4.0a
Ashwin Simha posted 1 decade ago reply 1 decade ago by Ivar KJELBERG
