Die Application Gallery bietet COMSOL Multiphysics® Tutorial- und Demo-App-Dateien, die für die Bereiche Elektromagnetik, Strukturmechanik, Akustik, Strömung, Wärmetransport und Chemie relevant sind. Sie können diese Beispiele als Ausgangspunkt für Ihre eigene Simulationsarbeit verwenden, indem Sie das Tutorial-Modell oder die Demo-App-Datei und die dazugehörigen Anleitungen herunterladen.
Suchen Sie über die Schnellsuche nach Tutorials und Apps, die für Ihr Fachgebiet relevant sind. Beachten Sie, dass viele der hier vorgestellten Beispiele auch über die Application Libraries zugänglich sind, die in die COMSOL Multiphysics® Software integriert und über das Menü File verfügbar sind.
Dieses Modell zeigt, wie Sie das Interface Magnetic Fields, Currents Only zusammen mit der Studie Stationary Source Sweep with Initialization verwenden können, um die Induktivitätsmatrix von Leiterplattenspulen mit einer Anzahl von 12 zu berechnen. Mehr lesen
Reflow soldering is an important process in IC packaging. In reflow soldering, the solder materials are melted to create joints between electrical components and the PCBs for structural and electrical connections. This model demonstrates the process of attaching chips to a PCB by reflow ... Mehr lesen
This model computes the lightning-induced voltage on an overhead line positioned above a lossy ground. It includes parameters like the inclination angle of lightning channels and soil conductivity, enabling straightforward analysis of their impacts. The calculated induced voltage aligns ... Mehr lesen
These models demonstrate the usage of the user defined lumped port and lumped elements to introduce excitations and lumped circuit elements between volumetric conductors. Additional models show how to use impedance and transition boundary conditions to model the conductors, instead of ... Mehr lesen
This tutorial explores how pulse reverse plating can be used as an additive-free alternative to attenuate small protrusions during copper metal deposition. By matching the process parameters, including the length of the forward and reverse pulses (duty cycles), a bright mirror-like metal ... Mehr lesen
This model demonstrates the "butterfly" filling mechanism for copper electrodeposition in a Through-Hole (TH) via exposed to an electrolyte containing halide-suppressor additives. The Tertiary Current Distribution, Nernst Planck interface in combination with Deformed Geometry is used ... Mehr lesen
This tutorial model explains how to extract lumped matrices by means of the Stationary Source Sweep study. The capacitance matrix of a five-terminal system is used to infer the position of a metallic object rather like real-world capacitive position sensors. The example illustrates the ... Mehr lesen
Microlithography lenses are used to project the image of an integrated circuit onto a silicon substrate. This tutorial demonstrates how to create a 21-element fused silica lens which has a NA of 0.56 which is designed to be used at a wavelength of 248nm. The lens, which has a total ... Mehr lesen
This model shows how to simulate a capacitively actuated surface micromachined accelerometer, using the Electromechanics Interface. It is based on a case study from the book Microsystem Design by Stephen D. Senturia (Kluwer Academic Publishers, 5th Edition, 2003, pages 513-525). Mehr lesen
Silicon micromechanical resonators have long been used for designing sensors and are now becoming increasingly important as oscillators in the consumer electronics market. In this series of models, a surface micromachined MEMS resonator, designed as part of a micromechanical filter, is ... Mehr lesen