Die Application Gallery bietet COMSOL Multiphysics® Tutorial- und Demo-App-Dateien, die für die Bereiche Elektromagnetik, Strukturmechanik, Akustik, Strömung, Wärmetransport und Chemie relevant sind. Sie können diese Beispiele als Ausgangspunkt für Ihre eigene Simulationsarbeit verwenden, indem Sie das Tutorial-Modell oder die Demo-App-Datei und die dazugehörigen Anleitungen herunterladen.
Suchen Sie über die Schnellsuche nach Tutorials und Apps, die für Ihr Fachgebiet relevant sind. Beachten Sie, dass viele der hier vorgestellten Beispiele auch über die Application Libraries zugänglich sind, die in die COMSOL Multiphysics® Software integriert und über das Menü File verfügbar sind.
Mit dieser Serie von acht Tutorial-Modellen und der dazugehörigen Dokumentation können Sie die resistiven, kapazitiven, induktiven und thermischen Eigenschaften eines standardmäßigen dreiadrigen bleiummantelten XLPE-HVAC-Unterseekabels mit verdrillter Magnetarmierung (500 mm2, 220 kV) ... Mehr lesen
Steel pipelines are often subjected to complex stress/strain conditions in the oil and gas industry. Additionally, pipes are subjected to significant longitudinal strain due to soil movement. For the elastoplastic stress simulation, the Solid Mechanics interface is used with the small ... Mehr lesen
One method of creating spring-like structures or inducing curvature in thin structures is to plate them to substrates that are under the influence of residual stresses. The plating process can control this stress even for similar materials. One such device is the electrostatically ... Mehr lesen
In this example, a settlement and heave analysis of a shallow foundation resting on an unsaturated soil stratum is conducted with the Modified Cam-Clay and Extended Barcelona Basic soil models. The effect of pore suction due to movements in the phreatic line and the resulting settlement ... Mehr lesen
This models pressure-dependent heating of 4 inch wafer on unipolar electrostatic chuck. Wafer sits on top of ring with electrostatic force holdong down wafer to counter upward pressure from gas flowing in gap between wafer and chuck surface. It is a problem involving 4 coupled physics ... Mehr lesen
Microlithography lenses are used to project the image of an integrated circuit onto a silicon substrate. This tutorial demonstrates how to create a 21-element fused silica lens which has a NA of 0.56 which is designed to be used at a wavelength of 248nm. The lens, which has a total ... Mehr lesen
The model includes a compilation of benchmark examples included in the text book: Shape Memory Alloys: Modeling and Engineering Applications. D. Lagoudas Ed. Springer 2008. The model uses the Souza–Auricchio model and shows the thermomechanical properties of a NiTi alloy sample ... Mehr lesen
This 3D model example demonstrates the use of the Primary Current Distribution interface for modeling current distributions in electrochemical cells. In primary current distribution, the potential losses due to electrode kinetics and mass transport are assumed to be negligible, and ... Mehr lesen
In this example, the Bergstrom–Boyce material model is used to capture the nonequilibrium behavior of carbon-black-filled chloroprene rubber under a strain history that alternates compression with relaxation. Results are verified against experimental and numerical results taken from ... Mehr lesen
The thin low permittivity gap boundary condition is meant to approximate a thin layer of material with low relative permittivity compared to its surroundings. This boundary condition is available for electrostatic field modeling. This example compares the thin low permittivity gap ... Mehr lesen
