Die Application Gallery bietet COMSOL Multiphysics® Tutorial- und Demo-App-Dateien, die für die Bereiche Elektromagnetik, Strukturmechanik, Akustik, Strömung, Wärmetransport und Chemie relevant sind. Sie können diese Beispiele als Ausgangspunkt für Ihre eigene Simulationsarbeit verwenden, indem Sie das Tutorial-Modell oder die Demo-App-Datei und die dazugehörigen Anleitungen herunterladen.
Suchen Sie über die Schnellsuche nach Tutorials und Apps, die für Ihr Fachgebiet relevant sind. Beachten Sie, dass viele der hier vorgestellten Beispiele auch über die Application Libraries zugänglich sind, die in die COMSOL Multiphysics® Software integriert und über das Menü File verfügbar sind.
This example shows how to model prestressed bolts. The bolt geometry is taken from the Part Libraries. For comparison, one of the bolts is modeled using a thread contact formulation, whereas the other bolt is connected to the bolt hole by a pure continuity condition. The reduced ... Mehr lesen
In this model, we introduce a cloaking method using an electrically tuned monolayer of graphene. We will show that when a cylindrical dielectric scatterer is covered in graphene, the scattering cross section is greatly reduced at the designated frequency, making it electromagnetically ... Mehr lesen
This model demonstrates how to setup a Time Domain to Frequency FFT study for a distributed Bragg reflector (DBR) structure. The results agree well with the results of a regular Frequency domain study. Mehr lesen
A transient model of a capacitor is solved in combination with an external electrical circuit. The finite element model of the capacitor is combined with a circuit model of a voltage source and a resistor. A step change in voltage is applied, and the transient current through the ... Mehr lesen
An der Elektroden-Elektrolyt-Grenzfläche befindet sich eine dünne Schicht von Raumladungen in einer diffusen Doppelschicht. Dies kann bei der Modellierung von Geräten wie elektrochemischen Kondensatoren und Nanoelektroden von Interesse sein. Dieses Tutorial-Beispiel zeigt, wie man die ... Mehr lesen
A surface mount resistor is subjected to thermal cycling. The difference in the thermal expansion of different materials will introduce stresses in the structure. The solder which connects the resistor with the printed circuit board is seen as the weakest link in the assembly. It ... Mehr lesen
This model simulates an LED that emits in the infrared part of the electromagnetic spectrum. The device structure is made up of a single p-n junction formed by a layer of p-type doping near the top surface of an otherwise n-type wafer. This kind of device geometry is simple and cheap to ... Mehr lesen
This example presents a homogenized model of a corrugated sheet based on a unit cell approach. The numerically obtained equivalent stiffness matrices are compared with various analytical models. Two corrugation profiles, trapezoidal and round, are considered in this example. Mehr lesen
