Die Application Gallery bietet COMSOL Multiphysics® Tutorial- und Demo-App-Dateien, die für die Bereiche Elektromagnetik, Strukturmechanik, Akustik, Strömung, Wärmetransport und Chemie relevant sind. Sie können diese Beispiele als Ausgangspunkt für Ihre eigene Simulationsarbeit verwenden, indem Sie das Tutorial-Modell oder die Demo-App-Datei und die dazugehörigen Anleitungen herunterladen.
Suchen Sie über die Schnellsuche nach Tutorials und Apps, die für Ihr Fachgebiet relevant sind. Beachten Sie, dass viele der hier vorgestellten Beispiele auch über die Application Libraries zugänglich sind, die in die COMSOL Multiphysics® Software integriert und über das Menü File verfügbar sind.
This model illustrates the charge/discharge control of a Lithium-Ion battery in a Simulink® simulation. Mehr lesen
This tutorial demonstrates how to model the band-to-band tunneling across a p–n junction. The tunneling effect is imitated by defining the User-Defined Recombination domain feature which makes the electrons disappear from the conduction band on the n-side and holes disappear from the ... Mehr lesen
This model computes the input impedance/admittance to an acoustic system in the frequency domain. The system here represents a typical measurement setup used for testing hearing aids and includes domains with thermoviscous boundary layer losses. The input admittance, computed in the ... Mehr lesen
FEM simulation can be used to obtain a SAW velocity and some related parameters (squared electromechanical coupling coefficient, reflectivity, etc.) for different typical configurations. Such parameters are input data for various analytical and semi-analytical methods of SAW device ... Mehr lesen
This tutorial example is kindly provided by Dr. James Ransley at Veryst Engineering, LLC. This model continues from the base model “A Micromachined Comb-Drive Tuning Fork Rate Gyroscope”, which is also provided by Dr. Ransley. The model demonstrates how to accurately compute the effects ... Mehr lesen
The ball grid array (BGA) technology is a surface-mount technology widely used in electronic packaging. Usually, there are two types of solder balls considered in the array, including the functional balls that are required for electric connections and the support balls that are used only ... Mehr lesen
This example studies viscoplastic creep in solder joints under thermal loading using the Anand viscoplasticity model, which is suitable for large, isotropic, viscoplastic deformations in combination with small elastic deformations. The geometry includes two electronic components (chips) ... Mehr lesen
The model of 1D Dielectric Barrier Discharge (DBD) has been recomputed with the three different kinds of electron energy distribution functions (EEDFs): The Maxwellian function The Druyvesteyn function The computed EEDF based on the Boltzmann Equation, Two-Term Approximation ... Mehr lesen
This model shows how to model a simple Metal–Insulator–Metal (MIM) diode. The two metal electrodes are defined on each side using the Metal Contact feature. Two studies were performed: one without quantum tunneling across the potential barrier and the other including it, using the WKB ... Mehr lesen
This tutorial demonstrates how to build the geometry for the 3D biased resonator from GDS file using the ECAD Import Module and the Design Module. The procedure emulates semiconductor and MEMS fabrication processes to build 3D geometry more efficiently and is more intuitive for those ... Mehr lesen
