Die Application Gallery bietet COMSOL Multiphysics® Tutorial- und Demo-App-Dateien, die für die Bereiche Elektromagnetik, Strukturmechanik, Akustik, Strömung, Wärmetransport und Chemie relevant sind. Sie können diese Beispiele als Ausgangspunkt für Ihre eigene Simulationsarbeit verwenden, indem Sie das Tutorial-Modell oder die Demo-App-Datei und die dazugehörigen Anleitungen herunterladen.
Suchen Sie über die Schnellsuche nach Tutorials und Apps, die für Ihr Fachgebiet relevant sind. Beachten Sie, dass viele der hier vorgestellten Beispiele auch über die Application Libraries zugänglich sind, die in die COMSOL Multiphysics® Software integriert und über das Menü File verfügbar sind.
This tutorial explores how pulse reverse plating can be used as an additive-free alternative to attenuate small protrusions during copper metal deposition. By matching the process parameters, including the length of the forward and reverse pulses (duty cycles), a bright mirror-like metal ... Mehr lesen
A Luneburg lens is a type of graded index, or GRIN lens, in which the gradient of the refractive index leads to special focusing properties. This example model uses the Geometrical Optics interface to compute the curved ray trajectories in the graded-index medium. Mehr lesen
Laser systems are an important application area in modern electronics. With nonlinear materials it is possible to generate harmonics that are a multiple of the frequency of the laser light. This model shows how a second harmonic generation can be set up as a transient wave simulation, ... Mehr lesen
This conceptual example shows how to calculate critical points in models with contact. The model consists of a block modeled with the Solid Mechanics interface pressing on an arch modeled with the Shell interface. The contact problem is solved using the augmented Lagrangian method. The ... Mehr lesen
In this example, triaxial and oedometer tests are simulated using the Hardening Soil material model. Both tests exhibit a hyperbolic stress–strain relationship. For the triaxial test, it is confirmed that the axial stress approaches the analytical failure stress asymptotically. In the ... Mehr lesen
As integrated circuit (IC) technology advances, with circuits becoming more powerful and compact, it is increasingly important to identify and prevent any cause of circuit failure. One particularly critical factor contributing to circuit failure is electromigration within the ... Mehr lesen
Battery electrodes featuring large heterogeneities in terms of particle sizes may sometimes not be adequately described by homogenized models using one single particle size only. As an alternative to adding multiple instances of the Additional Porous Electrode material node, this ... Mehr lesen
The model is defined as a benchmark case in norm 15026:2007 annex A. The purpose of the model is to calculate the temperature and moisture profiles at different times after a change in the external conditions (temperature and relative humidity) inside a wall material (kind of concrete). ... Mehr lesen
This example model consists of a two-hot-arm thermal actuator made of polysilicon. The actuator is activated through thermal expansion. The temperature increase required to deform the arms, and thus displace the actuator, is obtained through Joule heating (resistive heating). The greater ... Mehr lesen
The dielectric shielding boundary condition is meant to approximate a thin layer of material with high relative permittivity compared to its surroundings. This boundary condition is available for electrostatic field modeling. This example compares the dielectric shielding boundary ... Mehr lesen