Die Application Gallery bietet COMSOL Multiphysics® Tutorial- und Demo-App-Dateien, die für die Bereiche Elektromagnetik, Strukturmechanik, Akustik, Strömung, Wärmetransport und Chemie relevant sind. Sie können diese Beispiele als Ausgangspunkt für Ihre eigene Simulationsarbeit verwenden, indem Sie das Tutorial-Modell oder die Demo-App-Datei und die dazugehörigen Anleitungen herunterladen.
Suchen Sie über die Schnellsuche nach Tutorials und Apps, die für Ihr Fachgebiet relevant sind. Beachten Sie, dass viele der hier vorgestellten Beispiele auch über die Application Libraries zugänglich sind, die in die COMSOL Multiphysics® Software integriert und über das Menü File verfügbar sind.
In diesem Tutorial wird das Schwingungsverhalten einer kleinen Aluminiumplatte mit vier Wellenleiterstrukturen analysiert. Dies ist ein Beispiel für eine strukturelle Komponente, die sich in einem Gerät befindet, in dem sich elastische Wellen ausbreiten, wie zum Beispiel ein ... Mehr lesen
The model studied is a benchmark for a hinged cylindrical panel subjected to a point load at its center. A linear buckling analysis predicts the critical buckling load. Such an analysis will however not give any information about what happens at loads higher than the critical load. ... Mehr lesen
This example shows how to model prestressed bolts. The bolt geometry is taken from the Part Libraries. For comparison, one of the bolts is modeled using a thread contact formulation, whereas the other bolt is connected to the bolt hole by a pure continuity condition. The reduced ... Mehr lesen
Reflow soldering is an important process in IC packaging. In reflow soldering, the solder materials are melted to create joints between electrical components and the PCBs for structural and electrical connections. This model demonstrates the process of attaching chips to a PCB by reflow ... Mehr lesen
The External Material functionality makes it possible to program your own material models for cases when the built-in material models are not sufficient. For structural mechanics, you have the possibility to either completely define the material model in a domain, or to add an inelastic ... Mehr lesen
In this example, the homogenized elastic and thermal properties of a composite material based on a triply periodic minimal surface (TPMS) are computed. A gyroid TPMS-based unit cell is subjected to periodic boundary conditions to get the homogenized material properties. The effects of ... Mehr lesen
In this benchmark example, a semi-elliptical crack at the inner surface of a cylinder is studied. The inside of the cylinder and the crack faces are subjected to a pressure load. The J-integral is calculated along the crack front, and the stress intensity factor is then compared with the ... Mehr lesen
This example shows how to use response spectrum analysis to verify the integrity of a structure that is exposed to an earthquake. The building is modeled as a steel frame, using beam elements. Displacements and stresses are computed. Mehr lesen
Modern integrated circuits are available as plastic encapsulated microcircuits (PEM). These devices are molded out of polymeric materials and epoxy resins in order to protect the internal semiconductors. Unfortunately, polymeric mold compounds absorb moisture when exposed to a humid ... Mehr lesen
This example shows how to implement a stress dependent material model. The Young's modulus changes based on the stress value. Mehr lesen