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Modeling and Prediction of Line Pattern Collapse

D. Bassett[1], M. Carcasi[1], W. Printz[1]
[1]Tokyo Electron America, Austin, TX, USA

In semiconductor manufacturing, effective cleaning of structures with liquid is one of the most important and potentially difficult process steps. It is important because it remains the cheapest and most cost-effective method to remove particles and residues from the structures in order to prevent defects, but can also be difficult because as the structures dry, surface tension forces can cause ...

Numerical Study of Droplet Formation inside a Microfluidic Flow-Focusing Device

Y. Li[1], M. Jain[1], K. Nandakumar[1]
[1]Cain Department of Chemical Engineering, Louisiana State University, Baton Rouge, LA, USA

The micro-nanometer sized droplets have tremendous applications in bio-diagnostics, polymerization processes etc. In this work, we numerically investigate the droplet formation process of silicone oil in aqueous solution in a MFF device. A conservative level-set method is adopted to numerically model the droplet formation process numerically. The mono-dispersed and poly-dispersed droplet ...

Poroelastic Models of Stress Diffusion and Fault Re-Activation in Underground Injection

R. Nopper[1], J. Clark[2], C. Miller[1]
[1]DuPont Company, Wilmington, DE, USA
[2]DuPont Company, Beaumont, TX, USA

Stress and failure in the earth have long been observed to couple to hydrogeology. Poroelastic models, introduced by soil scientists, can account for strong two-way coupling between porous crustal rock formations and their pore fluids. Current efforts to provide new energy resources (water injection in EGS, enhanced oil recovery) and to reduce pollution (CO2 sequestration, deepwell disposal) ...

Steps for the Optimization of Pipe and Tubing Extrusion Dies

J.R. Puentes[1], T.A. Osswald[1], S. Schick[2], J. Berg[2]
[1]Polymer Engineering Center, University of Wisconsin, Madison, WI, USA
[2]TEEL Plastics, Baraboo, WI, USA

The extrusion of polyolefin pipes suffers degradation due to mechanical design problems of the extrusion die that is commonly used. This study uses numerical and computational approaches to detect problematic areas in the die geometry. Simulations show that in the conventional die there are areas of stagnation and recirculation of the melt flow, resulting in greater residence times, one of the ...

Turbulent Compressible Flow in a Slender Tube

K.O. Lund[1], C.M. Lord[2]
[1]Kurt Lund Consulting, Del Mar, CA, USA
[2]Lord Engineering Corp., Encinitas, CA, USA

Pressure-drop experiments were conducted for the turbulent, compressible flow of air in a small, slender tube, and modeled with COMSOL heat transfer module, and analytically. A scalar integration variable is introduced which integrates the mass velocity [kg/m²s] over the inlet area and iteratively equates this to the input mass flow [kg/s]. For computation, the temperature specification is ...

Modeling of a Jecklin Disk for Stereophonic Recordings

G. McRobbie[1]
[1]University of the West of Scotland, Paisley, Renfrewshire, UK

The Jecklin Disk is a sound absorbing disk placed between two omnidirectional microphones. It is used to recreate some of the frequency-response, time and amplitude variations human listeners’ experience, but in such a way that the recordings also produce a useable stereo image through loudspeakers. This paper presents a finite element model able to simulate the effects on sound propagation ...

Modeling Internal Heating of Optoelectronic Devices Using COMSOL

N. Brunner[1][,][2]
[1]Voxtel, Inc, Beaverton, OR, USA
[2]University of Oregon, Eugene, OR, USA

In this paper the heat transfer module in COMSOL is utilized to simulate internal heating of an Avalanche Photodiode due to light-induced current through a resistivity that depends on charge carrier concentrations in the device. Initial tests are done by modeling the heating process on a previously-solved silicon p-n junction as a proof of concept before advancing to a more complicated geometry. ...

Natural Convection Driven Melting of Phase Change Material: Comparison of Two Methods

D. Groulx[1], F. Samara[1], P.H. Biwole[2]
[1]Department of Mechanical Engineering, Dalhousie University, Halifax, NS, Canada
[2]Department of Mathematics and Interactions, University of Nice Sophia-Antipolis, Nice, France

Design of latent heat energy storage systems (LHESS) requires knowledge of heat transfer processes within them, as well as the phase change behavior of the phase change material (PCM) use. COMSOL Multiphysics can be used to model (LHESS). Natural convection plays a crucial role during the charging phase of the LHESS, and methods to incorporate this heat transfer mode within COMSOL simulation ...

COMSOL Thermal Model for a Heated Neural Micro-Probe

M. Christian[1], S. Firebaugh[1], A. Smith[1]
[1]United States Naval Academy, Annapolis, MD, USA

This project utilizes the heat transfer module of the COMSOL Multiphysics environment to model the effects that an ohmic heating probe will have on neural tissue. The model quantifies the thermal impact of active components embedded on a neural micro probe by solving the Penne’s bioheat equation with an external MATLAB function to determine the heat generation along the length of the probe. The ...

Orientation of Piezoelectric Crystals and Acoustic Wave Propagation

G. Zhang[1]
[1]Clemson University, Clemson, SC, USA

Surface acoustic wave (SAW) devices are commonly used as wireless filters, resonators, and sensors. The confinement of acoustic energy near the surface of a piezoelectric substrate in a SAW sensor makes it highly sensitive for discerning surface perturbation. As sensors, SAW devices have the potential to provide a high-performance sensing platform with capabilities of remote and high-temperature ...