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Implicit Large Eddy Simulations of 2D Flow and Heat Transfer in Thermoacoustic Resonators

N. Martaj [1,2], S. Savarese [3], S. Kouidri [3], M. M. ALI [4,5]
[1] EPF Ecole d’ingénieurs, Montpellier, France
[2] Institut d'Electronique et des Systèmes, Université de Montpellier, Montpellier, France
[3] Armélio, Les Ulis, Courtabœuf, France
[4] LIMSI-CNRS, Orsay, France
[5] UPMC Univ Paris 06, Paris, France

The reduction of energy consumption in the building sector (nearly 40% of the energy consumption in Europe) is a real challenge to achieve the objective of the “2020 European climate and energy package”. In recent years, great interest is observed for the Stirling thermoacoustic machines. Nonlinearities due to the high level of acoustic pressure generate DC flows that are superimposed on the ...

Simulation of a Magnetic Induction Method for Determining Passive Electrical Property Changes of Human Trunk Due to Vital Activities

H. Mahdavi[1], J. Rosell Ferrer[1]
[1]Universitat Politècnica de Catalunya, Barcelona, Spain

The human body consists of many different types of tissues each with specific passive electrical properties. Vital activities lead to a characteristic change of these properties and geometrical changes. Magnetic induction is a non-contact method which can be used to determine these changes. The method is based on the creation of a primary magnetic field that will produce eddy currents in the ...

COMSOL Multiphysics® Software: Time-Lapse Electrical Resistivity Inversion - new

T. K. Chou[1], M. Chouteau[1], M. J. Yi[2]
[1]Department of Civil, Geological & Mining Engineering, École Polytechnique de Montréal, Montreal, QC, Canada
[2]Korea Institute of Geoscience and Mineral Resources, Daejeon, South Korea

Time-lapse electrical resistivity tomography (ERT) method provides a non-invasive way to monitor subtle sub-surface changes caused by water flow such as in an infiltration test. Problems arise when the inversion models contain artifacts due to measurement errors, rapid change in soil electrical property during measurement time, etc. A new approach was developed by Kim et al. (2004) and (2009) ...

Investigating Magnetic and Electric Fields Couplings for 3D Models in Harmonic and Transient States

O. Maloberti [1], O. Mansour [1]
[1] ESIEE Amiens, Amiens, France

At present, no 3D transient magnetic and electric fields formulation with strong eddy currents and high electric fields is available in the physical applications with COMSOL Multiphysics® software. However, some industrial products need such a tool, as it is the case for induction coils of pulsed magnetic technologies. The principle is to induce a force thanks to strong eddy currents induced by ...

VLSI Layout Based Design Optimization of a Piezoresistive MEMS Pressure Sensors using COMSOL Multiphysics

R. Komaragiri[1], Sarath. S.[1], N. Kattabomman[1]
[1]NIT Calicut, Kozhikode, Kerala

This paper focuses on the diaphragm design and optimization of a piezoresistive Micro Electro Mechanical System (MEMS) pressure sensor by considering Very Large Scale Integration (VLSI) layout schemes. The aim of these studies is to find an optimal diaphragm shape by Finite Element Method (FEM) using COMSOL®, which is most suitable for VLSI layout. Optimal diaphragm shape is a diaphragm shape ...

Electromagnetic Parameters Extraction for Integrated-Circuit Interconnects for Open Three Conductors with Two Levels Systems

S.M. Musa[1], M.N.O. Sadiku[1], J.D. Oliver[1]
[1]Prairie View A&M University, Prairie View, TX, USA

The accurate estimate of values of electromagnetic parameters are essential to determine the final circuit speeds and functionality for designing of high-performance integrated circuits and integrated circuits packaging. In this paper, a new quasi-TEM capacitance and inductance analysis of multiconductor multilayer interconnects is successfully demonstrated using the finite element method (FEM) ...

Stress Evolution due to EM in Metal Line Confined: Model and Correlation with Experiments

G. Marti [1], L. Arnaud [2], Y. Wouters [3]
[1] STmicrolectronics & Univ. Grenoble Alpes-SIMAP, France
[2] Cea-Leti Minatec, Grenoble, France
[3] Univ. Grenoble Alpes-SIMAP, Grenoble, France

Electromigration induced failure is one of the main reliability issues for the microelectronics industry. The continuous scaling of the interconnect dimensions leads to higher operating current densities and temperatures, which accentuates the electromigration failure. As a consequence, electromigration still poses challenges for the development of the new technological nodes. Electromigration ...

Sensibility Analysis of Inductance Involving an E-core Magnetic Circuit for Non Homogeneous Material

K. Z. Gomes [1], T. A. G. Tolosa [1], E. V. S. Pouzada [1],
[1] Mauá Institute of Technology, São Caetano do Sul, SP, Brazil

In this work, a methodology is developed, based on the application of finite element method in the frequency domain, using the COMSOL Multiphyics software, aiming the sensibility analysis of inductance calculation involving some configurations of an E-core magnetic circuit. Such important analysis, are made from several geometries and considering different frequencies for the source current ...

Optimization of an Electromagnetic Actuator with COMSOL Multiphysics

T. Müller[1], A. Schwenger[2], and H. Haase[1]
[1]Institut für Grundlagen der Elektrotechnik und Messtechnik, Leibniz Universität Hannover, Germany
[2]Volkswagen AG, Germany

This paper describes the automatic optimization of an electromagnetic actuator using a genetic algorithm.  The actuator modeled here is dedicated for charge changing valve actuation in internal combustion engines. In the first step of the simulation, several operating points are calculated using the script language of COMSOL Multiphysics. In order to reduce computation time, only one segment of ...

Fast Computation of Capacitance Matrix and Potential Distribution for Multiconductor in Non-Homogenous Multilayered Dielectric Media

S.M. Musa[1], and M.N.O. Sadiku[1]

[1]Prairie View A&M University Networking Academy, Prairie View, Texas, USA

This paper presents the fast computational and modeling of multiconductor transmission lines interconnect in non-homogenous multilayered dielectric media using the finite element method (FEM). We illustrate the potential distribution of the multiconductor transmission lines for the models and their solution time. We compared some of our results of computing the capacitance matrix with method of ...