Sehen Sie, wie die Multiphysik-Simulation in verschiedenen Branchen eingesetzt wird
Multiphysik-Modellierung und -Simulation treiben Innovationen in Industrie und Wissenschaft voran – wie die zahlreichen Anwendungsbeispiele zeigen, die jedes Jahr in den Fachbeiträgen und Postern von Ingenieuren, Forschern und Wissenschaftlern auf der COMSOL Conference vorgestellt werden. Lassen Sie sich von den unten aufgeführten aktuellen Beiträgen inspirieren oder nutzen Sie die Schnellsuche, um eine bestimmte Präsentation zu finden oder nach Anwendungsbereich oder Konferenzjahr/-ort zu filtern.
Sehen Sie sich die Kollektion für die COMSOL Conference 2024 an
The accurate estimate of values of electromagnetic parameters are essential to determine the final circuit speeds and functionality for designing of high-performance integrated circuits and integrated circuits packaging. In this paper, the quasi-TEM analyses of symmetrical triple coupled ... Mehr lesen
A model utilizing interdimensional variable coupling is presented for simulating the thermal hydraulic interactions of the High Flux Isotope Reactor (HFIR) core at Oak Ridge National Laboratory (ORNL). The model’s domain consists of a three-dimensional fuel plate and a two-dimensional ... Mehr lesen
Subduction processes have great importance as are related to volcanism and earthquake occurrence. Old and cold plates should subduct steeper than younger ones, but the subduction angle is highly variable and does not always correlate with the age of the plates. Some researchers propose a ... Mehr lesen
In this work the influence of the geometry of the Vickers indenter tip on relevant indentation properties is investigated during instrumented indentation operated in the macro range (i.e. with forces ranging from 2 to 200 N) and carried out in the case of a homogenized (i.e. heat ... Mehr lesen
The microstrip line is widely used as the planar transmission line in microwave integrated circuits and high speed interconnecting buses. In this paper, we use COMSOL Multiphysics® to study multiconductor microstrip systems on microwave integrated circuits. We specifically illustrate ... Mehr lesen
Research at Fraunhofer EMI addresses the response of materials in extreme dynamic loads. Besides mechanical or thermal loads, intense electric pulse currents also represent an extreme dynamic load. Experimentally, metallic samples, mainly thick wires, were electro-mechanically loaded ... Mehr lesen
This paper utilizes lumped circuits equivalent and pressure acoustics to simulate the behavior of a PA loudspeaker in order to improve its design. Mehr lesen
Chemical vapor deposition (CVD) is a promising effective method for synthesis of graphene films. CVD graphene film is obtained from hydrocarbon species such as CH4 through complex catalytic chemical reactions on the surface of the catalyst. Therefore, studying the catalytic reaction ... Mehr lesen
A 2D numerical model for determination of sound reduction index is set up in this work. Results are in good agreement in middle and high frequency range when using solid structure approximation. Results are compared with experiment. Mehr lesen
One of the greatest challenges in developing algorithms for imaging from scattered fields is the lack of suitable scattered field data from known targets. It has proved quite difficult to acquire this data from measurements in the laboratory due the fact it can be costly, time ... Mehr lesen