Sehen Sie, wie die Multiphysik-Simulation in Forschung und Entwicklung eingesetzt wird
Ingenieure, Forscher und Wissenschaftler aus allen Branchen nutzen die Multiphysik-Simulation, um innovative Produktdesigns und -prozesse zu erforschen und zu entwickeln. Lassen Sie sich von Fachbeiträgen und Vorträgen inspirieren, die sie auf der COMSOL Conference präsentiert haben. Durchsuchen Sie die untenstehende Auswahl, verwenden Sie die Schnellsuche, um eine bestimmte Präsentation zu finden, oder filtern Sie nach einem bestimmten Anwendungsbereich.
Sehen Sie sich die Kollektion für die COMSOL Conference 2024 an
Surface plasmon resonance (SPR) sensors proved themselves as a promising device for many kinds of applications such as optical biosensing, binding constant determinationor nanofilm thickness measurements. Here we simulate using COMSOL Multiphysics® the light-polaritons coupling for the ... Mehr lesen
The High Flux Isotope Reactor at the Oak Ridge National Lab is in the research stage of converting its fuel from high-enriched uranium to low-enriched uranium. One of the areas being explored is the fluid-structure interaction phenomenon due to the interaction of thin fuel plates (50 ... Mehr lesen
The unique optical properties of plasmon resonances in noble metal nanoparticles have been extensively investigated owing to their ability to enhance the electric field amplitude but also to tailor its spectral and spatial distribution. Among all application domains, nonlinear optics ... Mehr lesen
The vibration of an electrodynamic loudspeaker driver causes a resulting sound pressure. For simple pistonic vibration, there is a simple relationship between the vibration and the sound pressure. For complex vibration patterns, however, different parts of the vibrating surface ... Mehr lesen
A contactless electromagnetic principle for the excitation of mechanical vibrations in resonant structures has been investigated. The principle relies on no specific magnetic property of the resonator except electrical conductivity and can be adopted for employing the structures as ... Mehr lesen
Flexible electronics are temporarily affixed to a rigid carrier such as glass or silicon prior to device fabrication to facilitate robotic handling of the device, but also to allow optical lithography to stay within overlay design registration budget; without the rigid carrier, a ... Mehr lesen
We present numerical simulations for the propagation of surface plasmon polaritons in a dielectric-metal-dielectric waveguide using COMSOL Multiphysics® software. We show that the use of an active dielectric with gain that compensates metal absorption losses enhances substantially ... Mehr lesen
Gallium nitride (GaN) and its related nitride alloys with special physical properties are in technical areas of high interest. The growing of gallium nitride boules on non-native sapphire or silicon carbide requires complicated mechanisms of defect reduction in the lattice structure. ... Mehr lesen
In this paper the heat transfer module in COMSOL is utilized to simulate internal heating of an Avalanche Photodiode due to light-induced current through a resistivity that depends on charge carrier concentrations in the device. Initial tests are done by modeling the heating process on a ... Mehr lesen
Established joining techniques like welding, soldering or brazing typically are characterized by a large amount of heat load of the components. Especially in the case of heat sensitive structures like MEMS this often results in stress induced deformation and degradation or even damaging ... Mehr lesen