Die Application Gallery bietet COMSOL Multiphysics® Tutorial- und Demo-App-Dateien, die für die Bereiche Elektromagnetik, Strukturmechanik, Akustik, Strömung, Wärmetransport und Chemie relevant sind. Sie können diese Beispiele als Ausgangspunkt für Ihre eigene Simulationsarbeit verwenden, indem Sie das Tutorial-Modell oder die Demo-App-Datei und die dazugehörigen Anleitungen herunterladen.
Suchen Sie über die Schnellsuche nach Tutorials und Apps, die für Ihr Fachgebiet relevant sind. Beachten Sie, dass viele der hier vorgestellten Beispiele auch über die Application Libraries zugänglich sind, die in die COMSOL Multiphysics® Software integriert und über das Menü File verfügbar sind.
A steel ball is pressed down against a rubber membrane. When the contact pressure exceeds a certain value, the two parts start sticking together. When the ball is retracted, the membrane is pulled upwards in the bonded region. During the retraction, the bond is partially broken. This ... Mehr lesen
This model describes the corrosion of magnesium (Mg) alloys in physiological environments using a phase-field formulation. The approach couples Mg dissolution kinetics with ionic transport, enabling the transition from activation-controlled to diffusion-controlled regimes to be captured. ... Mehr lesen
This model showcases a nail penetration experiment into a layered battery. It couples the Solid Mechanics, Lithium-Ion Battery, and Heat Transfer interfaces. A nail is punched into a sandwiched battery consisting of two electrodes and a separator. As soon as the nail connects both ... Mehr lesen
This example shows how to model isotropic volumetric growth and atrophy of soft biological tissues. The artery is represented by a cylinder that is stretched and compressed due to an applied axial load. As a result, the tissue undergoes growth and atrophy. Mehr lesen
Through-silicon vias (TSVs) allow chips or wafers to be connected vertically, making TSV a crucial technology for 2.5D and 3D packaging. The basic structure of a TSV consists of a deep hole penetrating a silicon substrate, a filling metal (usually copper) in the deep hole, and an ... Mehr lesen
Flip-chip (FC) is one of the advanced forms of semiconductor device packaging that is widely used in today's semiconductor packages for its capability to minimize packaging size while enhancing electrical interconnection density and transmission performance. In FC devices, the active ... Mehr lesen
