Die Application Gallery bietet COMSOL Multiphysics® Tutorial- und Demo-App-Dateien, die für die Bereiche Elektromagnetik, Strukturmechanik, Akustik, Strömung, Wärmetransport und Chemie relevant sind. Sie können diese Beispiele als Ausgangspunkt für Ihre eigene Simulationsarbeit verwenden, indem Sie das Tutorial-Modell oder die Demo-App-Datei und die dazugehörigen Anleitungen herunterladen.
Suchen Sie über die Schnellsuche nach Tutorials und Apps, die für Ihr Fachgebiet relevant sind. Beachten Sie, dass viele der hier vorgestellten Beispiele auch über die Application Libraries zugänglich sind, die in die COMSOL Multiphysics® Software integriert und über das Menü File verfügbar sind.
The homogenized material properties of a composite are computed based on the temperature-dependent properties of matrix and fiber. The homogenized parameters are compared to the analytical values derived from the rule of mixtures. This is an extension of model https://www.comsol.com ... Mehr lesen
Beam theories are well-developed for slender structures with homogeneous materials and isotropic cross-sections. The traditional beam theories do no apply to beams made of different materials in the cross-section. Therefore, a homogenization-based numerical model is needed to compute ... Mehr lesen
This model uses the Granular Flow and Membrane interfaces to simulate the packing of spherical grains in a flexible container, a procedure often found in the processing industry. In this example, grains are packed into a cubic container constructed of a thin polymer fabric. Two packing ... Mehr lesen
In semiconductor manufacturing, vacuum chucks are used to rapidly and contamination-free adsorb and secure wafers before processes such as transfer, lithography, and inspection. Traditional empirical design makes it difficult to quantify the effects of groove shape, size, distribution, ... Mehr lesen
This example illustrates a linear buckling analysis conducted for a corrugated conical shell, utilizing a single sector of the geometry along with cyclic symmetry periodicity edge conditions. The results are compared to those using the full shell geometry. Mehr lesen
Flip chip (FC) is a widely used form of advanced semiconductor packaging that yields high interconnection density and good signal transmission performance of the semiconductor device as well as a reduction in size. In FC devices, the chip is placed face down and directly bonded to the ... Mehr lesen
Through-silicon vias (TSVs) allow chips or wafers to be connected vertically, making TSV a crucial technology for 2.5D and 3D packaging. The basic structure of a TSV consists of a deep hole penetrating a silicon substrate, a filling metal (usually copper) in the deep hole, and an ... Mehr lesen
In direct bonding, the in-plane relative displacement between corresponding points on the bonding surfaces of the top and bottom wafers, denoted as IPD (In-Plane Distortion), is the primary yield killer in the bonding process. This model can predict the entire direct wafer bonding ... Mehr lesen
This model demonstrates how to extract the lumped parameters for an mBVD equivalent circuit from a FEM simulation and how to leverage such a model directly using the Electrical Circuit interface. A 3D layered FBAR resonator is considered as an example. Related Blog Post Leveraging the ... Mehr lesen
Flip-chip (FC) is one of the advanced forms of semiconductor device packaging that is widely used in today's semiconductor packages for its capability to minimize packaging size while enhancing electrical interconnection density and transmission performance. In FC devices, the active ... Mehr lesen
