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Hier finden Sie Veröffentlichungen und Präsentationen der weltweit stattfindenden COMSOL-Konferenzen. In diesen präsentieren Ihre Fachkollegen ihre neuesten mit COMSOL Multiphysics entwickelten Produkte und Ideen. Die Forschungsthemen umfassen ein weites Feld von Industrien und Anwendungsbereichen, die von Mechanik und Elektronik über Strömungen bis zur Chemie reichen. Nutzen Sie die Quick Search, um die zu Ihrem Forschungsbereich passenden Präsentationen zu finden.

Multibody Contact Analysis of an Rzeppa CV-Joint

L. Armellin[1], F. Gatelli[1], and G. Tanghetti[1]

[1]R&D Department, Metelli S.p.A., Cologne, BS, Italy

Ball joints are widely used in many applications. This paper describes the contact and kinematic analysis of an Rzeppa type constant-velocity joint (CV-joint). Starting from a conveniently simplified 3D model, at fixed joint angle of 45°, a CV-joint made of all “generic steel” components has been studied. Considering only a “perfect” geometry (i.e. not affected by ...

Fast 2D Simulation of Superconductors: A Multiscale Approach

V.M. Rodriguez-Zermeno[1], M.P. Sørensen[1], N.F. Pedersen[2], N. Mijatovic[2], and A.B. Abrahamsen[3]
[1]DTU Mathematics, Lyngby, Denmark
[2]DTU Electrical Engineering, Lyngby, Denmark
[3]Materials Research Division, Risø, DTU, Roskilde, Denmark

This work presents a method to calculate AC losses in thin conductors such as the commercially available second generation superconducting wires through a multiscale meshing technique. The main idea is to use large aspect ratio elements to accurately simulate thin material layers. For a single thin superconductor, several standard test cases are simulated including transport current, externally ...

Classical Models of the Interface Between an Electrode and an Electrolyte

E. Gongadze[1], S. Petersen[1], U. Beck[2], and U. van Rienen[1]
[1]Institute of General Electrical Engineering, University of Rostock, Rostock, Germany
[2]Institute of Electronic Appliances and Circuits, University of Rostock,
Rostock, Germany

The Electrical Double Layer (EDL) plays a major role in understanding the interface between a charged surface (e.g. an implant) and ionic liquids (e.g. body fluids). The three classical models of the EDL (Helmholtz, Gouy, and Chapman-Stern) are numerically solved for a flat surface electrode in the 3D Electrostatics application mode of COMSOL Multiphysics® 3.5a. The values of the electric ...

The Acoustoelastic Effect: EMAT Excitation and Reception of Lamb Waves in Pre-Stressed Metal Sheets

R.M.G. Ferrari[1]
[1]Danieli Automation S.p.A., Buttrio, UD, Italy

The acoustoelastic effect relates the change in the speed of an acoustic wave travelling in a solid, to the pre-stress of the propagation medium. In this work the possibility of assessing nondestructively the stress status in metal sheets, by using the acoustoelastic effect, is investigated. As the effect turns out to be very small for practical values of applied stress, the proposed technique ...

An Acoustical Finite Element Model of Perforated Elements

P. Bonfiglio[1][2] and F. Pompoli[1][2]
[1]Materiacustica S.r.l., Ferrara, Italy
[2]Engineering Department, University of Ferrara, Ferrara, Italy

The present work deals with a numerical investigation of resonating systems used for noise control applications. In literature one can find analytical models based on fluiddynamics concepts for evaluating losses occurring across the holes of the perforates. In the paper an acoustical formulation based on the equivalent dissipative fluid approach will be analyzed. It will be firstly applied to ...

Simulation of Daisy Chain Flip-Chip Interconnections

G.S. Durante[1] and M. Fretz[1]

[1]CSEM Zentralschweiz, Alpnach Dorf, Switzerland

Flip-chip interconnection technologies have been tested through the use of a test chip with embedded single-bump daisy chains. The Flip-Chip technologies are selected among Au bump Thermocompression (TC) with and without Nonconductive Adhesives (NCA) underfiller, anisotropic conductive adhesive (ACA) bonding, and AuSn20 eutectic solder. The single bumps were then measured with a high precision ...

3D Simulation of the Thermal Response Test in a U-tube Borehole Heat Exchanger

L. Schiavi[1]

[1]Dipartimento di Ingegneria Industriale, Università di Parma, Parma, Italy

Simulated Thermal Response Test (TRT) data are analyzed in order to evaluate the effect of the tridimensionality model’s feature in determining the proper value of the soil thermal conductivity and borehole thermal resistance. The 3D system’s simulation during the TRT is realized by adopting the finite element method. The comparison of the numerical results with the analytical ...

Measuring and Calculation of Positive Corona Currents Using COMSOL Multiphysics®

M. Quast[1] and N.R. Lalic[1]
[1]Gunytronic GmbH, St Valentin, Germany

The sensor type developed by Gunytronic uses corona discharge for measuring flow rates in exhaust streams of automotives, aircrafts and industrial plants. This paper will present the development of testing equipment used in laboratory for investigating physical relations on corona currents, charged particle transport, the calculation of the collateral electric fields and high potentials. This ...

Modelling Thermal Time-of-Flight Sensor for Flow Velocity Measurement

O. Ecin[1], E. Engelien[2], M. Malek[2], R. Viga[2], B. Hosticka[1], and A. Grabmaier[2]

[1]Institut of Mikroelektronische Systeme, University Duisburg-Essen, Duisburg, Germany
[2]Institut of Elektronische Bauelemente und Schaltungen, University Duisburg-Essen, Duisburg, Germany

This communication reports on a numeric fluid dynamics simulation on a pipe flow model. The basic background is to determine the velocity of a flowing fluid in a pipe by using the Thermal Time-Of-Flight (TTOF) method on water. The visualization of the temperature and velocity distribution in the pipe model is being carried out in order to enable proper design and optimization of the TTOF sensor. ...

Thermal Design of Power Electronic Devices and Modules

N. Delmonte[1], M. Bernardoni[1], P. Cova[1], and R. Menozzi[1]
[1]Dipartimento di Ingegneria dell’Informazione, University of Parma, Parma, Italy

This work describes a way to apply 3D Finite Element Analysis (FEA) to the thermal design of power electronic modules using simplified geometry models of the system components. The method here presented can overcome the problem of solving equation systems with a very high number of Degrees Of Freedom (DOF) due to complex geometry of a power module.

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