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Hier finden Sie Veröffentlichungen und Präsentationen der weltweit stattfindenden COMSOL-Konferenzen. In diesen präsentieren Ihre Fachkollegen ihre neuesten mit COMSOL Multiphysics entwickelten Produkte und Ideen. Die Forschungsthemen umfassen ein weites Feld von Industrien und Anwendungsbereichen, die von Mechanik und Elektronik über Strömungen bis zur Chemie reichen. Nutzen Sie die Quick Search, um die zu Ihrem Forschungsbereich passenden Präsentationen zu finden.

Study of Pull-In Voltage in MEMS Actuators

P. D. Hanasi[1], B. G. Sheeparamatti[1], B. B. Kirankumar[1]
[1]Basaveshwar Engineering College, Bagalkot, Karnataka, India

Micro cantilevers are the basic MEMS structures, which can be used both as sensors and actuators. The . The objective of this work is to study concept of pull-in voltage and how to reduce the same. Voltage is applied to upper cantilever beam and lower contact electrode is made as ground. By increasing common area between cantilever beam and contact electrode, and also by reducing thickness of the ...

Magnetic Ratchet

A. Auge, F. Wittbracht, A. Weddemann, and A. Hütten
Department of Physics, University of Bielefeld, Germany

Transport phenomena in spatially periodic magnetic systems, in particular the directed transport of magnetic beads in a so called magnetic ratchet (Brownian motor) are considered. Simulations are carried out to test and optimize this system, where the Smoluchowski equation with flux terms for the magnetic and gravitational force is used. Furthermore, experiments are carried out to verify the ...

Fluidmechanical Damping Analysis of Resonant Micromirrors with Out-of-plane Comb Drive

T. Klose[1], H. Conrad[2], T. Sandner[1], and H. Schenk[1]

[1]Fraunhofer Institute Photonic Microsystems (FhG-IPMS), Germany
[2]TU Dresden, Semiconductor and Microsystems Technology Laboratory, Germany

Damping is the liminting factor for the reachable maximum deflection. Thus, it is a very important issue for resonant microsystems. In this paper, we present a damping model for out-of-plane comb driven resonant micromirrors. The basic concept of this model is to attribute viscous damping in the comb gaps as the dominant contributor of damping moments. The model is extended by findings from a ...

Kinetic Investigation of a Mechanism for Generating Microstructures on Polycrystalline Substrates Using an Electroplating Process

T. Soares[1], H. Mozaffari[2], H. Reinecke[1]
[1]Universität Freiburg, Freiburg im Breisgau, BW, Germany
[2]Hochschule Furtwangen, Tuttlingen, BW, Germany

The purpose of this study is to understand the growth mechanism of copper (Cu) films on a Cu-Zn system substrate with a pre-defined pattern. The pattern was defined by conducting a selective etching process on a two-phase polycrystalline substrate. As a result of this process, there were etched regions correspondent to beta-phase crystals and quasi non-etched regions that belong to alpha-phase ...

Investigation on MEMS Based Thermal Sensor for Cancer Detection

A. V. Lakshmi[1], K. C. Devi[1]
[1]PSG College of Technology, Coimbatore, Tamil Nadu, India

This paper presents the design and simulation of a thermal sensor using COMSOL Multiphysics® software for the detection of low body temperature syndrome which can allow the early detection of cancer. This sensor is made of an alloy consisting of two materials with different coefficients of thermal expansion. The main objective of this work is to investigate the structural change in the sensor ...

Thermal Simulation of FCBGA Package with Heat Sink

M. R. Naik[1]
[1]Nitte Meenakshi Institute of Technology, Bengaluru, Karnataka, India

In a modern IC design, the capability of predicting the temperature profile is critically important as well as cooling and related thermal problems are the principal challenges. To address these challenges, thermal analysis must be embedded within IC synthesis. This paper presents thermal analysis of the FCBGA chip with a 4mm×4mm×0.3mm silicon die. The silicon die dissipates heat flux of ...

Finite Element Modeling of the Stress Field in a Cell-Seeded Microchannel

G. Zhu, and Y. Li
Lawrence Technological University, Southfield, MI, USA

Fluids used in biomedical microelectromechanical systems (BioMEMS) devices often exhibit very different flow behavior from those in bulk solutions, which in turn affects the behavior of cells and biomolecules in the device. In this work, we investigate an integrated microfluidic system for living cell culture and assay. The system can be used as a generic platform to study the behavior of ...

Electromagnetic Release Process for Flexible Electronics

G. Coryell[1][,][2]
[1]School for Engineering of Matter, Transport, and Energy, Arizona State University, Tempe, AZ, USA
[2]Chemistry Department, United States Naval Academy, Annapolis, MD, USA

Flexible electronics are temporarily affixed to a rigid carrier such as glass or silicon prior to device fabrication to facilitate robotic handling of the device, but also to allow optical lithography to stay within overlay design registration budget; without the rigid carrier, a freestanding flexible substrate such as polyimide would distort unacceptably during even minor temperature excursions ...

Shape, Convection and Convergence

R. Pryor
Pryor Knowledge Systems, Inc., Bloomfield Hills, MI, USA

COMSOL Multiphysics software, when properly configured, can readily solve modeling problems in the laminar flow regime using the standard Navier-Stokes equations or in the fully turbulent flow regime using the kappa-epsilon model. Failure to solve a particular model is typically manifested by instability in the calculation and a failure of the model to converge. This paper presents a new approach ...

Computational Analysis of Evaporation in Tailored Microchannel Evaporators

S. Arslan[1], J. Brown[1]
[1]Lawrence Technological University, Southfield, MI, USA

The rapid increase in power densities of integrated circuits has induced a significant interest in new reliable and high heat flux cooling technologies. The implication of such growth is the increased need for more efficient and more compact cooling mechanisms. Promising research has been conducted in the area of MEMS cooling devices, taking advantage of the increased heat transfer ...

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