Hier finden Sie Veröffentlichungen und Präsentationen der weltweit stattfindenden COMSOL-Konferenzen. In diesen präsentieren Ihre Fachkollegen ihre neuesten mit COMSOL Multiphysics entwickelten Produkte und Ideen. Die Forschungsthemen umfassen ein weites Feld von Industrien und Anwendungsbereichen, die von Mechanik und Elektronik über Strömungen bis zur Chemie reichen. Nutzen Sie die Quick Search, um die zu Ihrem Forschungsbereich passenden Präsentationen zu finden.

Nanoscale Structure Design in EM Fields Using COMSOL Multiphysics

J. Yoo[1], H. Soh[2], J. Choi[3], S. Song[4]
[1]Department of Mechanical Engineering, Yonsei University, Korea
[2]Hyundai Motor Co., Korea
[3]Samsung Electronics Co., Ltd., Korea
[4]Mando Co., Korea

Nanoscale structural analysis and design is presented. All the simulations are carried out using a finite element solver and optimization is performed using parameter and topology optimization schemes. It is concluded that COMSOL is effective for analysis and design of nanoscale structure design in electromagnetic field and it may be combined with several optimization methods to improve system ...

Shape, Convection and Convergence

R. Pryor
Pryor Knowledge Systems, Inc., Bloomfield Hills, MI, USA

COMSOL Multiphysics software, when properly configured, can readily solve modeling problems in the laminar flow regime using the standard Navier-Stokes equations or in the fully turbulent flow regime using the kappa-epsilon model. Failure to solve a particular model is typically manifested by instability in the calculation and a failure of the model to converge. This paper presents a new ...

Design of a RF MEMS Switch

B. Mishra, M. P. S. Naidu, J. Raj, and Z. C. Alex
VIT University
Vellore
Tamilnadu, India

This paper presents a novel design of a RF MEMS Switch. The switch is a capacitive type, which is actuated by an electrostatic force. The structure of the switch consists of a CPW (coplanar waveguides) transmission lines and a suspended membrane. The modelling of switch is done using COMSOL software and RF characteristics is found out by using CST software.

Resonant Frequency Analysis of Quartz Shear Oscillator

T. Satyanarayana[1], V. Sai Pavan Rajesh[2]
[1]NPMASS Centre, Lakireddy Bali Reddy Autonomous Engineering College, Mylavaram, Andhra Pradesh, India
[2]Lakireddy Bali Reddy Autonomous Engineering College, Mylavaram, Andhra Pradesh, India

The most commonly used type of resonator is the AT-cut, where the quartz blank is in the form of a thin plate cut at an angle to the optic axis of the crystal. This paper reports the modeling of a quartz oscillator for a resonant frequency analysis based on piezoelectric effects. The proposed oscillator consists of a single quartz disc with two electrodes on the top and bottom surfaces of the ...

Expanding Your Materials Horizons

R. Pryor[1]
[1]Pryor Knowledge Systems, Inc. (COMSOL Certified Consultant), Bloomfield Hills, Michigan, USA

Materials and their related properties are intrinsically fundamental to the creation, development and solution of viable exploratory models when using numerical analysis software. In many cases, simply determining the location, availability and relative accuracy of the necessary material parameters for the physical behavior of even commonly employed design materials can be very difficult and ...

Experimentally Matched Finite Element Modeling of Thermally Actuated SOI MEMS Micro-Grippers Using COMSOL Multiphysics

M. Guvench[1], and J. Crosby[1]
[1]University of Southern Maine, Gorham, Maine, USA

In “Micro-Electro-Mechanical-Systems” shortly known as MEMS, one of the most important and effective principle of creating transduction of electrical power to displacement force is thermal expansion. A slim beam of MEMS material, typically Silicon, is heated by the application of electrical current via Joule heating; it expands and creates motion. In the design of many MEMS devices ...

Thermomechanical Effects of the Packaging Molding Process on the Chip in Integrated Circuits - new

N. Semmar[1], M. Fournier[1], P. S. Alleaume [2], A. Seigneurin [3], , ,
[1]GREMI-UMR7344, CNRS/University of Orléans, Orléans, France
[2]Collegium Sciences et Techniques, Orléans, France
[3]ST Microelectronics Tours SAS, Tours, France

Usually, in integrated circuits, the chip is brazed on leadframe and then, a polymer resin is molded around to create the packaging. On the first hand, the molding process at high temperatures will induce thermomechanical stress on the chip. As the leadframe, the chip and the braze have all different thermoelastic properties, these stress can be critical for the chip connections. To ...

Three-Dimensional Percolation Properties Simulation of a Marine Coating Based on Its Real Structure Obtained from Ptychographic X-Ray Tomography - new

B. Chen[1], M. Guizar-Sicairos[2], G. Xiong[1], L. Shemilt[1], A. Diaz[2], J. Nutter[1], N. Burdet[1], S. Huo[1], F. Vergeer[3], A. Burgess[4], I. Robinson[1]
[1]London Centre for Nanotechnology, University College London, London, UK
[2]Paul Scherrer Institute, Villigen, Switzerland
[3]AkzoNobel Co. Ltd., Sassenheim, Netherlands
[4]AkzoNobel (UK) Co. Ltd., Tyne and Wear, UK

We present quantitative nano-scale analysis of the 3D spatial structure of an anticorrosive aluminium epoxy barrier marine coating obtained by ptychographic X-ray computed tomography (PXCT) [1-3]. We then use COMSOL Multiphysics® software to perform simulations on the acquired real 3D structure to demonstrate how percolation through this actual 3D structure impedes ion diffusion in the ...

Microfluidic Separation System for Magnetic Beads

F. Wittbrach, A. Weddemann, A. Auge, and A. Hütten
Department of Physics, Bielefeld University, Germany

It is possible to control the motion of magnetic beads using a combination of hydrodynamic and electromagnetic forces. In this work, we investigate the possibility to manipulate the motion of beads with different magnetic moments in a special microfluidic structure so as to separate them. We also experimentally prove that this structure is a suitable device to separate beads and show that the ...

Multi-Domain Analysis of Silicon Structures for MEMS Based-Sensors

N. Bhalla[1], S. Li[2], and D. Chung[1]
[1]Chung Yuan Christian University, Chungli,Taiwan
[2]National Tsing Hua University, Hsinchu, Taiwan

Investigation in this paper aims at performing Mechanical Stress Strain analysis, Thermal, Piezoresistive and Piezoeletric analysis of Silicon Structures using COMSOL. The simulation results have been cross checked by mathematical calculation.