Thermal Management with COMSOL Multiphysics® - Archived

This is a recording of a webinar that originally aired on January 27, 2022

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The design of power electronics and electronic consumer devices is becoming ever more challenging. Balancing strict space and temperature design constraints with the need to implement several heat sources, such as microchips and battery packs, presents a complex engineering challenge. Simulation can be used to address the challenge of fitting the different electronic components in ever smaller form factors while still ensuring the system remains below critical temperatures.

In this webinar, we will discuss simulating heat transfer by conduction, convection, and radiation using the Heat Transfer Module, an add-on product to the COMSOL Multiphysics® simulation software. We will also present some options to explicitly model heat sources, such as electrochemical and electromagnetic sources. The webinar will include a live demonstration of electrochemical heating and thermal management of a battery pack setup in the COMSOL Multiphysics® software, and will conclude with a Q&A session.

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Archived Webinar Details


Arno Dubois
Applications Engineer

Arno Dubois is an applications engineer at COMSOL UK, specializing in computational fluid dynamics. He received a BSc and MSc in marine technology from Delft University of Technology and a PhD from the Australian Maritime College, developing a numerical methodology to investigate a novel propulsion and maneuvering system for autonomous underwater vehicles.