Copper Deposition in a Trench Using the Phase Field Method

Application ID: 79891

The present model example is based on Copper Deposition in a Trench model available in Electrodeposition Application Library.

The nonuniform deposition along the trench surface leads to formation of a cavity/void. Since the Deformed Geometry interface cannot handle topological changes, the original model cannot be extended to simulate deposition after cavity formation.

In the present model, the Phase Field interface is used instead of the Deformed Geometry interface to simulate depostion also after the cavity has formed. The electrode kinetics at the deposition boundary is defined as a domain term making use of the delta function from the Phase Field interface. The model results obtained from the phase field formulation before the cavity has formed match well with the original model.

Dieses Beispiel veranschaulicht Anwendungen diesen Typs, die mit den folgenden Produkten erstellt wurden: