January 30, 2026 Mumbai, Maharashtra 9:30 a.m.–4:45 p.m.

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COMSOL Day Mumbai

See what is possible with multiphysics modeling

Join us for COMSOL Day Mumbai to see firsthand how multiphysics simulation can benefit your work. Whether you are considering using COMSOL Multiphysics® in your organization and want to see how it works, or an existing user looking to catch the latest news, this event has something for you.

View the schedule below and register for free today.

Schedule

9:30 a.m.

Learn the fundamental workflow of COMSOL Multiphysics®. This introductory demonstration will show you all of the key modeling steps, including geometry creation, setting up physics, meshing, solving, and evaluating and visualizing results.

10:00 a.m.

COMSOL Multiphysics® version 6.4 includes a set of important updates for chemical and electrochemical simulations. Power loss variables now make it easy to evaluate the magnitude of total power losses in a battery cell and compare losses among individual components, such as the separator, electrode, and current conductor, in order to assess efficiency and identify dominant loss mechanisms (due to ohmic, activation, and concentration overpotentials). A new feature is available for defining arbitrary charge–discharge load cycles, enabling realistic charging, discharging, and operating sequences and supporting more detailed analysis of performance under practical conditions.

For chemical reaction engineering, version 6.4 brings unprecedented accuracy to the modeling of turbulent reacting systems with reacting flow functionality for large eddy simulations (LES). For applications such as pharmaceutical manufacturing and advanced materials processing, accurate modeling of particle growth, morphology, and breakage is made possible with new support for particle aggregation and breakage. This functionality enables realistic simulation of evolving particle-size distributions in crystallization, precipitation, and granulation processes. Additionally, a new moving-bed reactor feature makes it possible to model heterogeneous reactors where the solid phase is continuously consumed and replenished.

In this session, we will take a closer look at these updates.

10:45 a.m.
Keynote Talk
Using COMSOL Multiphysics® to Develop Sensors for Structural Health Monitoring

In this keynote talk, Dr. Siddharth Tallur will discuss two use cases showing how COMSOL Multiphysics® was used in the development of sensors for structural health monitoring (SHM). The first use case deals with the application of piezoelectric transducers for monitoring the rate of corrosion of sacrificial anodes used in a cathodic protection system. The second use case deals with the inspection of defects in metallic pipelines using torsional ultrasonic guided waves.

In addition, he will talk about related SHM technology development activities presently being explored by his lab at the Indian Institute of Technology Bombay (IIT Bombay).

11:15 a.m.
Tea Break
11:45 a.m.

COMSOL Multiphysics® version 6.4 introduces significant improvements for electromagnetics modeling. In the AC/DC Module, induction boundary conditions are now supported for time-domain modeling, and magnetomechanics analysis can be performed for thin structures. The RF Module and the Wave Optics Module introduce new functionality for analyzing far-field radiation in the presence of a substrate.

The Ray Optics Module includes new scattering options for light–tissue interactions, humid environments, and other scenarios involving multiple scattering dynamics. An extended material property set for glasses provides all parameters required to perform structural-thermal-optical performance (STOP) analysis.

As for device-level simulation, updates to the Semiconductor Module include new functionality for modeling ferroelectric and piezoelectric semiconductors as well as easier multiphysics modeling of novel semiconductor architectures, such as memristors.

The Electric Discharge Module offers improved stability and computational efficiency for electric discharges, including switching arc simulations.

Join this session to learn more about these updates in COMSOL Multiphysics® version 6.4.

12:30 p.m.
Keynote Talk
From FEA and CFD to Digital Twins in Industrial Engineering

In this keynote talk, Ishant Jain will showcase how finite element analysis (FEA) and computational fluid dynamics (CFD), when embedded early into research, development, and engineering (RD&E), can significantly accelerate industrial product development while improving reliability, safety, and manufacturability. Drawing from real-world case studies across glass-lined reactors, chemical process equipment, advanced materials, and energy systems, Jain will demonstrate how simulation-led decision-making helps engineers move from empirical trial-and-error to predictive, physics-based design.

The talk will also highlight how simulation forms the foundation for digital twins and artificial intelligence (AI)-assisted RD&E, enabling scalable and trustworthy engineering innovation in complex industrial environments.

1:00 p.m.
Break for Lunch
2:20 p.m.
Keynote Talk
Simulation of Magnetohydrodynamic Effects and Liquid Metal Flow

In this keynote talk, Srikanta Sahu will discuss the Institute for Plasma Research (IPR)'s ongoing research activities focused on understanding magnetohydrodynamic (MHD) phenomena, which arise from the interaction between liquid metal flows and magnetic fields. Sahu will explain how the COMSOL Multiphysics® software has been extensively used to design and analyze laboratory-scale MHD-based devices such as electromagnetic flowmeters and pumps. His talk will also demonstrate how the software supports the study of the thermal–hydraulic behavior of liquid metals and associated MHD effects, enabling deeper insight and performance optimization of liquid metal systems.

2:50 p.m.

COMSOL Multiphysics® version 6.4 includes a set of important updates for fluid flow and heat transfer simulations. In the CFD Module, enhanced turbulence modeling introduces scale-adaptive simulation (SAS) for the shear stress transport (SST) turbulence model, providing accurate time-dependent flow predictions. In addition, this version includes an Elliptic Blending R-ε turbulence model for improved near-wall fidelity, along with support for new reacting flows with large eddy simulation (LES) that couples mixing, heat transfer, and chemical reactions.

The Mixer Module adds a rotating frame feature as an efficient alternative to full rotating domain setups, as well as algebraic turbulence models for high Mach number flows in rotating machinery. The Polymer Flow Module introduces process modeling for curing processes in both fluids and solids. Porous media flow capabilities common to many add-on modules now support periodic conditions between boundaries and pressure jumps across free–porous interfaces, enhancing modeling of subsystems and representative volume elements.

The Heat Transfer Module adds support for refraction in radiative heat transfer and improved modeling of thermal radiation in participating media. The Metal Processing Module now includes functionality for induction hardening of steel parts and new tools for modeling the austenitization of steel phases.

Join this session to learn more about these updates in COMSOL Multiphysics® version 6.4.

3:35 p.m.
Tea Break
4:00 p.m.

COMSOL Multiphysics® version 6.4 introduces significant enhancements for structural mechanics and acoustics simulations. In the Structural Mechanics Module, new explicit dynamics capabilities for solids and trusses enable the simulation of fast, transient, and highly nonlinear events such as impact, wave propagation, and metal forming. To simplify the setup of models with many potential contact interactions, a new automated contact modeling approach has been introduced that creates contact conditions between multiple objects without manual specification. The Nonlinear Structural Materials Module adds support for nonlinear material models and phase-field damage modeling for explicit dynamics, along with a faster Hencky strain decomposition for inelastic strain computations.

In the Composite Materials Module, improved modeling for layered shells supports variable-angle fiber laminates, enhanced formulations for failure criteria, and better coupling between layered shells and solid structures. The Rotordynamics Module introduces a new Rotating Frame feature for solid rotor interfaces, extended functionality for dynamic coefficients for bearing analyses, and an option for mode tracking in eigenfrequency studies used to generate Campbell diagrams. The Multibody Dynamics Module introduces a new modeling tool for easier handling of mechanical joints.

The Acoustics Module now offers multi-GPU support for time-explicit pressure acoustics, CGNS flow data import for aeroacoustics modeling, a new Poroacoustics feature for transient and time-explicit pressure acoustics, and a dedicated periodic port boundary condition for automated handling of diffraction orders.

Attend this session to learn more about these updates in COMSOL Multiphysics® version 6.4.

Register for COMSOL Day Mumbai

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COMSOL Day Details

Location

The Orchid Hotel Mumbai Vile Parle
Chamber (Lobby Level) 70/C, Nehru Road, Adjacent to Domestic Airport, Vile Parle (E)
Mumbai, Maharashtra 400099
Directions

Invited Speakers

Dr. Siddharth Tallur IIT Bombay

Dr. Siddharth Tallur is an associate professor in the Department of Electrical Engineering at the Indian Institute of Technology Bombay (IIT Bombay) and cofounder and director at Nirixense Technologies. He has previously served as faculty-in-charge of Wadhwani Electronics Lab (WEL) at IIT Bombay.

Prior to joining IIT Bombay, Dr. Tallur worked at Analog Devices, Inc., USA, on MEMS sensor product and applications development. His current research interests include high-resolution and low-cost sensors and high-speed instrumentation and embedded sensor systems, most notably for structural health monitoring and biosensing.

Ishant Jain HLE Glascoat

Ishant Jain is a senior RD&E technology leader with more than 15 years of experience delivering end-to-end research, development, and engineering programs across industrial manufacturing, chemical and process equipment, advanced materials, and energy transmission and distribution (T&D) systems. He currently leads global RD&E, innovation, and technology transfer initiatives across HLE Glascoat.

He holds an MTech in metallurgy from the Indian Institute of Technology Kanpur (IIT Kanpur) and has extensive hands-on experience applying finite element analysis (FEA) and computational fluid dynamics (CFD) to accelerate product development, improve reliability, and enable manufacturable designs. His work in simulation-led RD&E has resulted in several research papers published in international journals, along with numerous industrial case studies.

Jain has more than 36 publications and case studies and is an inventor on more than 40 patents across process equipment, advanced materials, energy systems, and industrial products. His prior industry experience includes Raychem RPG and Tata Steel. He regularly speaks on simulation-driven RD&E, digital twins, and engineering-led innovation.

Srikanta Sahu Institute for Plasma Research (IPR)

Srikanta Sahu is a scientific officer at the Institute for Plasma Research (IPR), Gandhinagar, India, where he has been working since 2011. Sahu completed his MSc in physics at Banaras Hindu University (BHU), Varanasi, India, and has more than 15 years of experience in liquid metal research and development. He was a visiting scholar at the University of California, Los Angeles (UCLA), CA, USA, during 2015 and 2016 and has authored more than 20 papers in international peer-reviewed journals. His current research interest is liquid metal magnetohydrodynamics, with applications for flow measurement, electromagnetic pumping, and thermal hydraulics.